Electronics Forum | Mon Jun 30 22:02:43 EDT 2003 | davef
If you don't seal your packaging, the silica gel will try to remove the moisture from the air and will become saturated pretty quickly. There is no requirement that you pack/ship with dessicants. Some customers require such things though. Why do y
Electronics Forum | Sat Jun 28 22:52:34 EDT 2003 | ramanandkini
We have an Electromechanical assembly (clock) that has a step motor on the board. This electromechanical assembly is assembled in a screw less plastic moulded casing. The plastic casing is neither air tight nor water proof. The board is with SMOBC+ H
Electronics Forum | Wed Jul 02 06:56:34 EDT 2003 | davef
There's nothing wrong doing about adding a dessicant. You'll need to: * Seal the bag. [you may end-up needing a moisture barrier bag] * Select a dessicant packaging that is ESD dissipative.
Electronics Forum | Tue Jul 01 21:06:12 EDT 2003 | ramanandkini
My customer just assembles it to the car. We want to use the silica gel to avoid moisture since the assembled part (clock) reach him via ship after 50 days. The electronic circuit board has no conformal coatings at present. We are working on that. Ou
Electronics Forum | Mon Mar 21 20:18:40 EST 2005 | davef
What is the specific problem? Tell about: * Resistor pack * Board layout * Stencil aperatures
Electronics Forum | Tue Feb 07 11:55:27 EST 2023 | tommy_magyar
What I would look at is the chemicals being used in the facility where the complaints are. Flux/flux gel, IPA, cleaning agents, etc. Perhaps you should limit the usage to certain people only, who would be trained how to properly use these. Something
Electronics Forum | Thu Nov 11 08:06:00 EST 2004 | no gel pig fan
I would definately try to sell the bosses on the Grid-lok over the gel piggies. We evaluated both and wound up buying the Gel (for close to the same money). On an MPM if you put enough gel packs in the vacuum box (to support the board) it holds the b
Electronics Forum | Tue Nov 05 09:21:18 EST 2002 | stefwitt
After all, you may want to consider a Flip Chip process. The chips are bumped with tiny solder balls while still on the wafer. You may present the bumped chips in Gel Pack, trays or Surftape to your Pick $ Place machine ( if capable for Flip Chip pl
Electronics Forum | Thu Jul 03 08:40:23 EDT 2003 | Kris
Hi, undercured solder resists may be a defect people have seen so far. Some of the probles arising is blistering as well as reaction with wave solder flux that may lead to some kind bad gel like formations. Gels the idea would be to reflow the ba
Electronics Forum | Tue Sep 14 06:08:46 EDT 2004 | sc
The general control on QFP fine-pitch coplanarity is +3mils. suggest to look at the re-use of thrown out component from SMT machine. If the component pack in std pack, then most probably the lifted is due to processing, not incoming as the packaging
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