Electronics Forum: general production devices (Page 1 of 86)

Is there some general file format for chip placement on pcb

Electronics Forum | Thu Nov 27 02:52:33 EST 2003 | Giordano Trecca

I'm using a CIM software (http://www.aiscorp.com/products_npi_circuitcam.htm) to import gerber files and produce pick&place programs and paper/paperless documentation. It's very friendly, useful and fast, but not cheap. I don't know any other softwa

Re: Ball Deformation Inspection for CSP devices

Electronics Forum | Thu Jun 03 15:15:09 EDT 1999 | J.S.

| I am currently sourcing equipment to mount CSP devices. I have looked at the GSM Flexjet & also the Siemens 80 F series. However these machines only look for ball presence not ball deformation. Panasonic are the only ones who have a 3-D camera capa

Solder mask and fine pitch devices

Electronics Forum | Tue Jan 08 09:23:18 EST 2013 | lock_2002

This is a question regarding soldermask between pins of fine pitch devices. The majority of our production designs end up with at least 2-3 mils of copper thickness on the external layers due to blind vias, wrap plating requirements, etc. Our curre

Re: Classification of moisture sensitive devices

Electronics Forum | Sat Aug 28 08:41:12 EDT 1999 | Tom Tellinghuisen

Wolfgang, We also tried to find generic 'guidelines' for Moisture Sensitivity levels. It would be a perfect world, if you could say that all PLCC84's were level 4 devices. Unfortunately it is not that easy. Moisture sensitivity levels are

Maximum production per SMT Line

Electronics Forum | Fri Jun 04 17:41:17 EDT 2004 | ricardof

Hi to all, I have one question that I hope to receive comments - Does anyone know or have any experience for the maximum boards you can run on a SMT line, this is quite general, but let's consider a board 8" x 8", about 400 components. Regardless of

Required humidity for SMT production and storage

Electronics Forum | Thu Apr 12 13:04:47 EDT 2007 | slthomas

Handling requirements of all classifications of moisture sensitive devices is found in J-STD-033. It really isn't an issue for most parts unless they're going to reach reflow temperature again, which is unlikely unless you're removing a nearby compo

Warming up solder paste at start of days production

Electronics Forum | Mon Jul 26 19:40:17 EDT 2004 | Grant

Hi, That's a good idea. I might head down the the 7-Eleven, and try it! I did not realize there is not too much to be gained by using refrigeration. We don't keep much paste in stock and buy it as we need it, so perhaps we should just keep it out r

How to run SMT production with low defects

Electronics Forum | Thu Aug 15 15:44:46 EDT 2002 | dragonslayr

You can't control what you don't measure. You have provided very little detail other than post reflow costs are high. What defects are attributed to problems experienced prior to reflow? Are these random or recurring defects? You will need to put ea

queations about the production of semiconductor component, including wafer IC decrete device

Electronics Forum | Tue Dec 03 16:35:15 EST 2019 | slthomas

:poop: Rats. Just checking.

queations about the production of semiconductor component, including wafer IC decrete device

Electronics Forum | Tue Dec 03 11:01:39 EST 2019 | scotceltic

Trying to find the smiley emoji for your response Dave. Thanks for the laugh.

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