Electronics Forum | Mon May 06 11:50:15 EDT 2019 | sankarseptember
I am using siplace XS Series mounter..I am getting component missing.. atleast one or two per shift production..I wonder this machine don't have option to check at last if any miss or thrown up component.what I need to check? I need any expert in sip
Electronics Forum | Wed Jun 05 10:16:29 EDT 2019 | emeto
Sankar, it looks like you need an expert to help you. Missing component might be related to hardware, machine setup or software issues on you equipment which will require a tech or engineer to investigate.
Electronics Forum | Tue May 07 12:50:17 EDT 2019 | sankarseptember
Thanks for the response Thomas..You are correct I got solder paste on both edge on the nozzle type 4007. But it uses for nearly 30 types of part number ..and also I will get missing without any issues in nozzle..I am unable to find the trace in that.
Electronics Forum | Tue May 07 13:49:05 EDT 2019 | tey422
Like I stated before, I am not familiar with the machine. I can only make suggestions. If you found solder paste on the nozzle, clean it off to prevent part stuck to the nozzle tip. I would also check if the nozzle tips are being worn off; uneven we
Electronics Forum | Wed May 08 07:19:03 EDT 2019 | youngbuck
Hi Sankar, I have had experience with the SX and X2 so I'm not sure how similar ours is to yours but i can give you some suggestions. 1. As Thomas said you could do a vaccum check and make sure the 4007 nozzle has around the same settings as the ot
Electronics Forum | Mon May 06 16:34:20 EDT 2019 | tey422
First of all, I am not familiar with the machine you stated. But there is something you should check out. That is if the nozzle tips having solder paste stick to it or not. If nozzle tips having a fresh paste stick to it, the component might not a
Electronics Forum | Wed Sep 03 12:29:47 EDT 2008 | omid_juve
That could lead to oxidation of the leads and > worsen solderability. It's much better to make > sure the components are handled properly and not > exposed to moisture. > > The reason for baking is > moisture in the body not in the leads. > > W
Electronics Forum | Wed Sep 03 12:34:43 EDT 2008 | stepheniii
I've seen where a new person comes on with some strange problem. Then someone else new comes on and says that the perfect solution is siplace boards. And for a while it seemed like Siplace boards were the solution to every problem. Or maybe they we
Electronics Forum | Tue Sep 02 12:43:12 EDT 2008 | stepheniii
That could lead to oxidation of the leads and worsen solderability. It's much better to make sure the components are handled properly and not exposed to moisture. The reason for baking is moisture in the body not in the leads. Why is no one suggest
Electronics Forum | Tue May 13 15:21:51 EDT 2003 | stefwitt
I know, it can be done and I participated in many acceptance tests, in which we counted even the milliseconds. However, my vision had a bit shifted, since the time the Motorola�s and Flextronic�s dumped all these high volume machines to the market. I
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