Electronics Forum | Tue May 02 11:50:26 EDT 2000 | Dan Foose
The first step in pinpointing the exact source of the fibers is to have them identified. Are they fiber glass, epoxy or flux? Or are they something else? I can help you with this if you want. Check out mfg-answers.com\ .
Electronics Forum | Fri Aug 09 12:04:45 EDT 2013 | horchak
well now the truth comes out, and nothing like the smell of burning fiber glass in the morning lol
Electronics Forum | Thu Aug 30 21:57:02 EDT 2001 | davef
We don't use fussy things like that to remove mouse-bite tabs when they are not designed to be removed. Just cut away the majority of the waste using sheet metal shears. Then burr the remainder and the rough parts with a Sears wood router [bought a
Electronics Forum | Fri Mar 03 16:05:42 EST 2006 | Chris
Hi, Anyone ever perform a DOE on prepreg glass bundle direction or glass bundle grain and how or if it affects PCB warpage and chip component cracking at V-score depanel? Since most FR4 and prepreg has has 1.4 times more fiber bundles in one direct
Electronics Forum | Fri Apr 06 04:10:25 EDT 2001 | kensmoke
We recently had a multi block panal change at the vendor Now the production lines are producing solderability defects in great number. The makeup of the pcb is a type of fiber glass mask green in color and pads with no tinning just copper lands.
Electronics Forum | Wed Apr 24 21:33:02 EDT 2019 | pcbindex1
With the upcoming of the traditional peak season(Q3), a rising price among the mainland factories, and a continual rise in the bronze price in the London Metal Exchange in August, there is also a trend for the rise in the quotation of the PCB’s upstr
Electronics Forum | Tue Nov 07 08:01:10 EST 2006 | davef
We/ve never heard of "glass wicking failure" in regards to board fab. Boat fab, yes. Look here: http://www.boatdesign.net/forums/showthread.php?t=13321 Barrel cracking appears after thermal stress during soldering, because epoxy expands in the "z"
Electronics Forum | Wed Jun 14 21:49:42 EDT 2006 | davef
Bryan: * Most of our stencils are made from stainless steel that is held by a aluminum frame, attached with epoxy with a fiber glass intermediary between the frame and the stencil. * We use stencils to print either glue [thermoset epoxy] or solder pa
Electronics Forum | Mon Sep 14 09:09:10 EDT 1998 | Earl Moon
| I am running composite fixtures on my wave solder machine and after about 500 passes each (1 month)they are showing serious signs of wear in that the composite surface is bubbling up and glass fibers are also starting to show. | The problem here
Electronics Forum | Thu Jun 24 10:48:02 EDT 1999 | Earl Moon
| Recently, there has been an upsurge in the Pin Hole/Blow Hole problem in our wave soldering process. We are baking the PCBs for 2 Hrs. at 125 degree C. The Wave Soldering profile seems to be O.K. Still the problem is persistent. Can somebody hel
