Electronics Forum: glue (Page 10 of 120)

Re: curing methode adhesive glue

Electronics Forum | Wed Apr 05 22:42:28 EDT 2000 | Dave F

George: I would think so. We use an old Vitronics (822??) IR reflow oven to clue SMT adhesives. Gp get 'em!!! Dave F

change from reflow to glue

Electronics Forum | Tue Jul 10 10:47:12 EDT 2012 | jorge_quijano

We do the same when it happens, we only warn the people arround to stay away while the oven is open, or delimitate the oven with a caution cord.

Standoff heights for glue syringes

Electronics Forum | Tue Aug 04 11:10:22 EDT 1998 | Chrys

| Hi Stoney, | Justin is giving you some good advice, unfortunately these kinda' problems sometimes call for the ol' D.O.E...otherwise, you could be chasing your tail for a while until you figure out exactly what's causing your problems. | Has

Re: Reflow glue and past.

Electronics Forum | Wed Feb 09 21:29:28 EST 2000 | Dave F

Charlie: People cure glue using their paste reflow profile all the time. And most of them are happy. Personally, I�m with Dean and Travis. It�s possible to as you suggest, it�s appealing not to mess with your oven profile, but it just doesn�t s

Re: Reflow glue and past.

Electronics Forum | Tue Feb 08 14:49:23 EST 2000 | Travis Slaughter

I have never tried this and wouldn�t really even want to consider it. Epoxy generally cures at around 160c in a fairly short amount of time, solder paste requires much more time and a peek temperature of about 210c or more in some cases. Curing you

Re: Reflow glue and past.

Electronics Forum | Wed Feb 09 22:33:27 EST 2000 | Dave F

All: I don�t think this isn�t what Charlie was asking about, but since he�s got our juices flowing on the topic, does anyone have a sense about running paste and adhesive at the same time, beyond the issues that we spoke about in responding to Charl

Re: Reflow glue and past.

Electronics Forum | Thu Feb 10 16:00:31 EST 2000 | Travis Slaughter

I have had cases when it was necessary to run epoxy and paste at the same time. The only good reason I know of to even think about messing with going to this trouble is if the surface tension of the solder melting pulls the part out of alignment. T

The glue with the holes...

Electronics Forum | Fri Oct 19 09:06:00 EDT 2001 | LW

I was somewhat involved with Kermit Aguayo during his work on the SMA-void problem, as I was with one of the SMA suppliers at the time. I recall the problem being related mainly to absorption of moisture by the uncured adhesive. Some SMA formulatio

change from reflow to glue

Electronics Forum | Thu Jul 12 10:23:30 EDT 2012 | blnorman

Check with your adhesive manufacturer. In a previous life we had one line that was either double sided reflow or wave following reflow. When it was ds reflow, we just shut off the wave. When it was reflow/wave, we kept the reflow oven on with the

The glue with the holes...

Electronics Forum | Thu Oct 18 18:37:49 EDT 2001 | davef

You�re correct. Probably every supplier�s product has slightly different cure characteristics. Let me spin this up a little differently � There was a slight imbroglio in my office this morning involving a couple of stalwarts and the last Krispy Kr


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