Electronics Forum | Sat Sep 01 18:14:39 EDT 2001 | Dreamsniper
your glue volume measurement is dictated by your stencil aperture size and thickness when you use stencil printing. Why you need to measure your glue volume deposition? I don't think that this is the right way yet for your undefined problem. What's t
Electronics Forum | Thu Aug 30 21:57:26 EDT 2001 | Franky
I have problem about glue printing measurement ,anybody has process of glue printing . How do you measure? as I know "push test" is the method for testing the strength of connection of component and board but I don't have specification of testing for
Electronics Forum | Sat Oct 06 08:36:04 EDT 2001 | davef
Your point about thermosets getting soft in the preheater of the wave is well taken. But an adhesive that is used past its expiry or other up-front lack of process control represent 99 & 44/100 percent of the reason for �glued parts falling off in
Electronics Forum | Fri Oct 05 16:05:58 EDT 2001 | seand
Hello everyone, Your chief variable here is going to be your epoxy. Different materials react accordingly to various inspection methods but, DEPENDING on your print parameters and material, you may be able to utilize an inline inspection machine.
Electronics Forum | Fri Oct 05 07:46:24 EDT 2001 | george
Specifications of testing force are not fixed, but (incase of wave soldering) the value should be at least 120-150 % of the force the wave. So for small chip components we assume that the force from the wave on the component is about 3 Newton, this m
Electronics Forum | Tue Dec 19 04:04:52 EST 2006 | ec
Hi, I been facing this problem in the past...... Now, I have change to printing. In the past, glue dotting is my bottom neck and need to use 2 glue dotting machine....and now, with printing proces, no more bottom neck in glue process and quality als
Electronics Forum | Tue Dec 19 03:46:24 EST 2006 | en
I facing problem when running glue process. the glue size cannot maintain with the same size when the glue in syrince reduce. it become smaller, smaller and smaller compare to the time. Beside, when there have any changing model, the machine stop for
Electronics Forum | Tue Mar 07 21:19:50 EST 2000 | Van Hoang Dinh
I have few problems below, 1.I had problem with clean glue stencil at the midle of the process and after the process. 2.Very hard to Fix the bridging on the (close pin) connectors through the wave. Anyone can help on this. Thanks Van
Electronics Forum | Tue Mar 07 21:19:50 EST 2000 | Van Hoang Dinh
I have few problems below, 1.I had problem with clean glue stencil at the midle of the process and after the process. 2.Very hard to Fix the bridging on the (close pin) connectors through the wave. Anyone can help on this. Thanks Van
Electronics Forum | Wed Dec 20 04:08:09 EST 2006 | ungun
Sorry for the late reply. I use glue dispenser machine juki kd-775. It have dispensing diameter confirmation unit, but dispensing test tape can be hold for 2 to 3 days a roll if the output 300 pcs pcb with average glue point 100 per peace. Beside, i
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