Electronics Forum | Fri Jan 03 11:42:38 EST 2003 | soupatech
Hi, I am loading a new board with mostly 0603 packages. The pads are .5 mm apart and I am having a big problem with parts shifting towards eachother instead of centering on the pads. I believe this is caused by too much solder. I am using a 7mil sten
Electronics Forum | Thu Jan 09 10:58:30 EST 2003 | soupatech
Thanks for the input.... I ordered a 5 mil stencil AND used more tooling under the board. This gave me a much smaller deposit of solder. I wouldn't swear that was my problem but 96 boards later the problem is 99% gone. I believe there was just too mu
Electronics Forum | Thu Jan 09 10:47:36 EST 2003 | Hussman
Depends on what you mean by shifting towards each other. Otherwise, 7 mil should be fine for 0603. I've used 6mil, 7mil and 8 mil without problems. Generally, stencil thickness won't have a bearing on "shifting" parts. Check placement. Make su
Electronics Forum | Sat Jan 04 09:02:17 EST 2003 | davef
Q1. What is the recommended stencil thickness to apply the proper amount of solder for 0603 components? A1. The proper amount of solder is determined by: * Metal content of the solder paste. * Stencil thickness. * Aperture opening. * Other factors,
Electronics Forum | Fri Jan 03 12:01:46 EST 2003 | jax
Alot of the companies out there use Standards developed internally, centered around there paste, equipment, and reflow processes. Normally you will see either 5mil or 6mil stencils used for everything in house with the exceptions of specific boards.(
Electronics Forum | Tue Mar 07 21:19:50 EST 2000 | Van Hoang Dinh
I have few problems below, 1.I had problem with clean glue stencil at the midle of the process and after the process. 2.Very hard to Fix the bridging on the (close pin) connectors through the wave. Anyone can help on this. Thanks Van
Electronics Forum | Tue Mar 07 21:19:50 EST 2000 | Van Hoang Dinh
I have few problems below, 1.I had problem with clean glue stencil at the midle of the process and after the process. 2.Very hard to Fix the bridging on the (close pin) connectors through the wave. Anyone can help on this. Thanks Van
Electronics Forum | Thu Mar 09 20:48:30 EST 2000 | Dave F
Van Hoang: Welcome to SMTnet!!!! Regarding your problems: 1. Cleaning glue: Check the SMTnet archives. For instance, a recent thread was: cleaning glue off of stencils - pr 13:41:43 03/03/2000 2. Bridging on the wave: Bridging on the wave h
Electronics Forum | Thu Mar 09 20:48:30 EST 2000 | Dave F
Van Hoang: Welcome to SMTnet!!!! Regarding your problems: 1. Cleaning glue: Check the SMTnet archives. For instance, a recent thread was: cleaning glue off of stencils - pr 13:41:43 03/03/2000 2. Bridging on the wave: Bridging on the wave h
Electronics Forum | Mon Oct 08 20:58:35 EDT 2001 | ericchua
Look like no way you can measure after glue printing. We have been running glue printing for about 2 years and using the "push test" method for testing the strength of connection of component and board. I don't see any problem. For component ( 0603 &
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