Electronics Forum: gold[0] (Page 1 of 1)

Lead Free finish

Electronics Forum | Tue Oct 28 12:02:11 EDT 2008 | milas

Hi We have recently specified the following on a bareboard that has an ENIG finish. Does it sound about right or is it likely to give me problems ? Nickel : 3uM � 7uM Gold : 0.05 uM � 0.1 uM Thanks in advance

nickel corrosion

Electronics Forum | Thu Jul 15 06:27:50 EDT 2010 | xps

Hi after an enviromental test 85C/85RH, for 3 months (powered), of an electronic assembly with edge finger tabs ENIG finished (nickel 5micron, gold 0.02micron), the nickel disappears completely under the gold (due to corrosion, I think). Does anyone

ENIG

Electronics Forum | Wed Jan 21 04:14:19 EST 2009 | sachu_70

Hi Adam, I would suggest you refer IPC-2221 guidelines which define plating thickness as: Nickel 2.5-5.0 um , Gold 0.08-0.23 um. Although ENIG is a standard process, there is an associated risk towards Gold embrittlement, Porous Gold, or Black pad de

Printing problem, water soluble paste with gold plating PCB..

Electronics Forum | Sun Jul 29 23:58:08 EDT 2001 | Frank

Hi Dave Thanks for your information. The problem that I found is paste not stick well on pads ( solder paste printing process). When the table move down (PCB saperate from stencil) some of paste stick on aperture instead pads. Solder paste : Delta

soft gold vs immersion gold

Electronics Forum | Mon Aug 16 13:18:46 EDT 2004 | davef

You bet our reponse changes. Q2R: Hard gold thickness is 4 to 10 u" for Au and 300 to 400 u" for nickel A2R: This is a hard gold spec?? It looks like a ENIG spec. Although, the Ni is quite heavy, 150 uin is sufficient for most applications. The gol

Au Plating

Electronics Forum | Tue Jun 04 17:10:13 EDT 2002 | davef

First, �flash gold� is very loose language. It means different things to different people. �Flash� gold is a thin coat of immersion gold. Imm gold self-limits at ~0.3um[12uin]. And fabs put-down �flash� prior to electroplating thicker gold for wi

IMMERSION GOLD VS HARD GOLD PLATTING

Electronics Forum | Thu Jan 09 15:19:41 EST 2014 | davef

For a typical wear surface application [millions of wipes], I agree with hege. You need to be talking electrolytic gold, NOT immersion gold. IPC-2221 says something like ... For edge connectors and areas not to be soldered: * Nickel - 2.5um [~100uin]

Gold coated spring contacts

Electronics Forum | Wed May 30 17:49:49 EDT 2001 | davef

You are correct. IPC wants you to pay for that standard, regardless if you get a hard copy or download it. Generally, it�s pretty boring stuff for production types. [Although, you will recognize some of the goofy things your designers have done to

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