Electronics Forum | Thu Nov 11 17:49:54 EST 1999 | Jeff_Tamagi
Do I have to tin gold lead devices? Can I use indium? Can I use lead-free Can I use tin-free
Electronics Forum | Thu Nov 11 18:39:06 EST 1999 | John Thorup
Assuming that you are going to solder them into a board rather than socket them, yes. The thickness of the gold plating in this application will usually make up a large enough percentage of the total joint to threaten enbrittlement. Use a small sol
Electronics Forum | Fri Nov 12 16:59:58 EST 1999 | John Thorup
Hi Michael While driving home last night I realized the omission in my response. I thought someone would call me on it. I should have clarified that the dissolution of the gold into the joint would be affected by the thickness of the gold plating,
Electronics Forum | Fri Nov 12 16:27:43 EST 1999 | Michael Allen
The papers I've read suggest that we need to be concerned if the weight percent of gold in the finished joint exceeds 3%. You might want to do the calculations to see where you stand, before you set up a process to "tin" the leads. If you find that
Electronics Forum | Fri May 28 17:30:35 EDT 1999 | Dave Clements
I discovered that we have some gold plated (30 mico in.) through hole connectors which were Paste In Hole soldered (60 sec at reflow) on a HASL PCB. Do we have an embrittlement reliability issue? The calculated volume % of gold in the joints is about
Electronics Forum | Fri May 28 17:44:51 EDT 1999 | Glenn Robertson
| I discovered that we have some gold plated (30 mico in.) through hole connectors which were Paste In Hole soldered (60 sec at reflow) on a HASL PCB. Do we have an embrittlement reliability issue? The calculated volume % of gold in the joints is abo
Electronics Forum | Fri Jun 03 15:19:32 EDT 2022 | dwl
I don't recall thicknesses off the top of my head but brittleness becomes an issue more for gold plating then ENIG. .125 um should be fine. also, gold ain't cheap so its unlikely your PCB fab will get anywhere near the max tolerance. On the other e
Electronics Forum | Wed Jun 08 23:04:26 EDT 2022 | SMTA-64387544
Au thickness of 0.125 um should not cause solder joint embrittlement. Also, PCB fab should offer Au thickness range between 0.05-0.075 um for better process control and reliability. Higher Au thickness may suggest black pads leading to solder joints
Electronics Forum | Mon May 12 22:40:19 EDT 2003 | nyazga
I have always heard to use solder with 2 percent silver to reduce gold embrittlment. One vendor site said this is a myth. Does anyone know of a specific document recommending this such as IPC or MIL spec. ???
Electronics Forum | Tue Jun 13 08:17:06 EDT 2006 | davef
The solder alloy does not change based on the flux. Your potential for embrittlement is the same [providing the metal of the solders are the same] with either solder. We would guess the OA flux is [and drag tinning are] removing corrosion from the
