Electronics Forum | Fri Apr 13 12:37:35 EDT 2001 | edylc
>>> gold finger was covered by a Kapton tape and it was done offline away from the Screen printer or rather from the SMT lines itself, we are using an ENIG Pcb's , the process doesnt need a wave soldering ....however at the final end of the line ,
Electronics Forum | Mon Jul 27 21:10:10 EDT 1998 | D.Lange
| Hi, | Need some advice on how to eliminate or reduce the solder on finger that we are having right now. So far what we understand is that 90% of the problem is due to the reflow process where solder traps in vias causing explosion when subj
Electronics Forum | Tue Aug 18 12:02:59 EDT 1998 | zambri
| Hi, | Need some advice on how to eliminate or reduce the solder on finger that we are having right now. So far what we understand is that 90% of the problem is due to the reflow process where solder traps in vias causing explosion when subj
Electronics Forum | Tue Jul 28 02:28:48 EDT 1998 | Bob Willis
The causes for solder on gold are: Paste wash offs Dirty stencils Dirty under stencil cleaning cloths/no solvent Poor handling The most common reason is wash offs when there is a couple of balls left on the tabs and they reflow. With correct profile
Electronics Forum | Wed Sep 18 22:53:24 EDT 2002 | davef
Please give us background on your situation, so that we can focus on the specifics, for instance: * This is a bare board problem, correct? Then, this contamination causes what the problems in your process? * What is the type [ie, FR4, CEM1, etc] of
Electronics Forum | Sun Sep 22 13:14:56 EDT 2002 | scottefiske
Stop the lines...! Stop building defects and rework into your product. Contact Fab Supplier and have pipeline filled for small amount of replacement fabs to keep lines running and limiting production scheduling and impact. Request to have the board
Electronics Forum | Thu Oct 28 17:46:44 EDT 1999 | Gary Kemp
My company manufactures memory modules and I'm finding solder specs on the gold fingers following the reflow process. We are using a no-clean solder paste. The spec sheet warns against crossing the 140 degree C mark during the soak stage, preventin
Electronics Forum | Sun Jan 31 23:03:57 EST 1999 | Dennis O.
| | hi, | | i am working towards developing a no-clean process for a customer at contract manufacturing facility. the assemblies have gold fingers on them. these are masked to prevent from any damage to them during reflow soldering. the earlier pr
Electronics Forum | Sat Jan 23 12:37:35 EST 1999 | parag palshikar
hi, i am working towards developing a no-clean process for a customer at contract manufacturing facility. the assemblies have gold fingers on them. these are masked to prevent from any damage to them during reflow soldering. the earlier process ut
Electronics Forum | Thu Jan 13 12:47:03 EST 2000 | morris
Wolfgang: What is the mask material? What type of process/tools are required to remove it? Approximate cost per PCB?
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