Electronics Forum | Mon Aug 16 16:37:08 EDT 2004 | davef
As we mentioned in an earlier response in this thread [Q5], you do NOT want to solder to hard gold. Hard gold is a wear surface. [That's IT, that's the LIST.] If you want to solder to gold, then either use: * IPC-4552 ENIG specification, mentioned
Electronics Forum | Wed Aug 11 18:36:03 EDT 2004 | davef
90 Knoop. Q2: Thickness is 4 to 10 u" for Au and 300 to 400 u" for nickel A2: This looks like a ENIG spec. Although, the Ni is quite heavy, 150 uin is sufficient for most applications. [IPC-4552 ENIG specification: * Gold thickness of 0.075 - 0.125
Electronics Forum | Sun Mar 12 19:09:45 EST 2006 | cmiller
We had the same issue on a batch of boards and the board house concluded it was because they did the sikscreen before the imersion gold. (which was done out of house-which is very undesireable). I never knew if this was really the case but thought I
Electronics Forum | Wed Aug 31 12:33:25 EDT 2005 | Jaya
I have expirence running,double sided Imm gold boards recently which ed up a lot of solderability issue. The Imm gold need to be slightly more control during reflow oven area on it's profile.
Electronics Forum | Wed Aug 06 16:35:31 EDT 2003 | Carol
This is an old topic, but keeps coming up. Solderability and reliability issues with SMT gold plated terminations when used with tin/lead solder paste/hassle finish PWB. I need to know which standard (mil, IPC, J-STD??) tells you all about the probl
Electronics Forum | Wed Nov 10 16:03:07 EST 2010 | davef
Were the gold surfaces acceptable: * At incoming inspection * After first reflow ... How do know this issue was caused by the second reflow?
Electronics Forum | Wed Dec 28 16:03:53 EST 2005 | Chris
I have lots of experience with thermosonic gold ball bonding. You can read the literature and you will probably find some papers that say you can do it. I have never been able to do it. We gold ball bond all day long with little problems at all bu
Electronics Forum | Tue Dec 27 14:51:49 EST 2005 | davef
What's the issue and situation?
Electronics Forum | Wed Nov 10 16:33:09 EST 2010 | esoderberg
I don't. However we perform inline ICT and functional testing on both sides and the first side has never had issues. It is only when we flip the board and start reflowing on the bottom side.
Electronics Forum | Fri Nov 26 05:22:44 EST 2010 | 89jeong
Hello Esoderberg. Did you get the analyis report from your vendor? If so, could you pls share it wiht us? Based on my experiance, this issue may be caused by the Au plating. You need to ask your vendor to check the Au thickness or Au plating proces
