Electronics Forum | Fri Aug 22 09:49:31 EDT 2003 | davef
Ask your supplier for a corrective active and failure analysis of the boards. In parallel, send the boards to a failure analysis laboratory to determine the material on your gold pads. Take your work to another supplier.
Electronics Forum | Wed Feb 03 16:45:20 EST 1999 | Mark Henebry
Does anyone know if I will have problems soldering surface mount components to an all hard gold plated PC board. We want to use hard gold similar to gold used for edge fingers because our customer is concerned about wear and conductivity of connector
Electronics Forum | Thu Aug 21 22:10:07 EDT 2003 | adlsmt
Well, for some reason the board house will pay for the boards but has some issue with paying for the parts on them. Why am I not supprised? Perhaps I have mis-diagnosed the problem. We have found two different board p/n's with the same type of defec
Electronics Forum | Thu Aug 21 12:31:54 EDT 2003 | adlsmt
I have some finished boards that I have concluded have "black pad" defect. Outside of the black crap on some of the solder joints, if the boards are electrically functional, are they reliable? Any opinions would be appreciated as I dont want to throw
Electronics Forum | Thu Aug 21 20:39:09 EDT 2003 | davef
You have one option: Take the boards to the fabricator that build the board and ask him for $20k.
Electronics Forum | Tue Apr 26 11:22:48 EDT 2005 | denismeloche
I have found that Sn62 solder gives better strength and leach resistance when soldering to gold surfaces. The gold needs to be at least 5 to 10 micro inches thick to prevent nickel oxidation but if over 25 micro inches will cause brittleness. I hav
Electronics Forum | Sat Apr 14 09:28:58 EDT 2007 | davef
When soldering a component to a board, the solderability protection on the component combines with the solderability protection on the board and the solder to form an alloy. This alloy is unique for that combination of solder and solderability protec
Electronics Forum | Thu Aug 21 22:47:39 EDT 2003 | adlsmt
Well after reading all kinds of stuff about this I still question if it is my current problem BUT, how common is this??? I dont want to be afraid of the boogie man but it seems like a lot of folks are having problems with black pad. I have used imers
Electronics Forum | Sun Apr 24 09:12:00 EDT 2005 | davef
We're not sure what your customer is talking about either. Gold and tin form an intermetallic compound [IMC] that can cause poor solder connections. To minimize the potential of a problem, keep gold to less than 3 percent of the metal. [Search the
Electronics Forum | Mon Mar 20 09:24:38 EST 2000 | John Sipper
1. Spec references for max allowable untinned gold near glass seal and case body? 2. Low cost mechanical dip system to facilitate tinning of DIP parts. (Low volume; currently using hand solder iron techniques to allow for max coverage without bridg
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