Electronics Forum | Tue Jun 13 08:17:06 EDT 2006 | davef
The solder alloy does not change based on the flux. Your potential for embrittlement is the same [providing the metal of the solders are the same] with either solder. We would guess the OA flux is [and drag tinning are] removing corrosion from the
Electronics Forum | Mon Jun 12 07:42:56 EDT 2006 | brian.perry@suntroncorp.com
We are placing a gold plated device (LCC) to a NiAu PCB using a SnPb No-clean solder. We're noticing quite a bit of difficulty with reliable joints (intermittent connectivity) and if we have to rework a particular device, adjacent devices of this sa
Electronics Forum | Mon Dec 13 00:05:28 EST 1999 | Dennis O'Donnell
I can't figure out why everyone is plating everything with gold. According to the J Standard, gold plating should be removed before soldering to the surface. The gold, when left on the surface to be soldered will contaminate the solder joint and ca
Electronics Forum | Wed Jul 29 13:44:45 EDT 1998 | David Spilker
We are investigating alternatives to HASL finishes for more dense PWBs. OSP is not a good choice because of low solid flux and possibly long shelf life. Immersion gold is expensive and so far has been more difficult to wave solder. Has anyone had
Electronics Forum | Wed Jul 12 11:26:12 EDT 2006 | flipit
Hi, I believe you have classic gold imbrittlement here. With 80 microinches of gold you are way over the limit. You can try to reflow longer time and at a higher temperature. The gold does not melt into the solder joint. The gold dissolves into
Electronics Forum | Mon Dec 13 10:12:45 EST 1999 | John Thorup
Hi Dennis The gold plating on a circuit board is present to protect the nickle plating from corrosion. The layer is so thin that as it goes into solution in the solder it constitutes only a small percentage of the total joint. It is commonly accept
Electronics Forum | Wed Aug 05 07:46:46 EDT 1998 | Earl Moon
| We have mixed to negative feelings about Omikron, but I beileve it is due to problems with the board fabricator rather than the process itself. When done properly, our Omikron boards have had very good solderability. However, we have had several
Electronics Forum | Sun Apr 24 09:12:00 EDT 2005 | davef
We're not sure what your customer is talking about either. Gold and tin form an intermetallic compound [IMC] that can cause poor solder connections. To minimize the potential of a problem, keep gold to less than 3 percent of the metal. [Search the
Electronics Forum | Wed Aug 06 16:35:31 EDT 2003 | Carol
This is an old topic, but keeps coming up. Solderability and reliability issues with SMT gold plated terminations when used with tin/lead solder paste/hassle finish PWB. I need to know which standard (mil, IPC, J-STD??) tells you all about the probl
Electronics Forum | Tue May 13 06:57:10 EDT 2003 | davef
Your vendor site is totally correct. 2Ag is an excellent solder, but it does nothing to prevent tin and gold from reacting chemically. An earlier poster is correct gold goes into solution in liquid solder very fast, less than a second. Gold and ti
