Electronics Forum | Fri Dec 14 13:58:07 EST 2001 | slthomas
This is one I haven't seen before (not in this context, anyway). We have an assembly that we have the SMT done out of house on, because of the high volumes. The boards have two distinct characteristics with respect to the appearance of the solder jo
Electronics Forum | Wed Oct 03 21:28:38 EDT 2001 | davef
A firm grasp on the sublime. Mike points-out a good reason to describe Claude's problem as "open connections" or "open solder connections"? [Ahhh geez, wut a spoil spurt]
Electronics Forum | Sat Dec 15 10:11:58 EST 2001 | davef
Lumpy doesn't sound good. Why not section some of these connections to convince your vaulted leaders that this is not the product they should be shipping to your customers?
Electronics Forum | Fri Jul 03 04:03:36 EDT 1998 | Steve Cheung
Does anyone know why this typically occurs. We have seen capacitors crack due to stressing. Any good solutions? Regards, Steve.
Electronics Forum | Mon Jun 01 17:41:20 EDT 2009 | gregoryyork
What is your squeegee pressure and size. Also does the pad sit on a ground plane, as it looks like it is partially reflowed so surface has gone but not coallesced properly which would indicate it is more a problem with reflow above 217-219C OR obviou
Electronics Forum | Fri May 14 00:28:09 EDT 1999 | Mike D.
| I am seeing reflow around my signal pins after being subjected | to a profile of 204c for 1 minute and 225c for a min of 30 seconds. Signal pins are soldered into a copper plated alum. case with SB5 and then silver plated. The pins have a hot oil
Electronics Forum | Mon Jul 20 17:40:48 EDT 1998 | socheat khun
| Does anyone know why this typically occurs. We have seen capacitors crack due to stressing. Any good solutions? | Regards, | | Steve. Hi steve! Did you check component date-code, reflow profile and component placement height. it has happen to me
Electronics Forum | Tue Nov 13 21:59:42 EST 2007 | davef
This processes has the potential to cause barrel cracking and pad lifting, because the heating is very hot [troop crank-up the volume on their iron when they see thick boards] for a relatively small area on one side of the board. What do we suggest
Electronics Forum | Wed Apr 03 04:08:20 EDT 2013 | ericrr
Yes well, now we used to add a bit of flux to our leaded paste to make it slightly runny, But when we went to unleaded paste the joker who came in from another company to set the temperature on the oven said "you dont add anything to unleaded paste!.
Electronics Forum | Wed Apr 03 19:03:31 EDT 2013 | hegemon
In agreement, in that you should have already printed enough paste on the board to accomodate the joint. Adding paste would give the result you described. (too much solder) Adding a little flux (only) and heat would be the correct path out of that s
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