Electronics Forum | Wed Mar 28 08:45:03 EDT 2007 | pjc
I have seen point-to-point soldering iron tip robots in action at a number of factories. The problem is repeatability at delivering good solder joints. Consider a small selective solder machine, the nozzle type: www.ace-protech.com www.air-vac-eng.c
Electronics Forum | Wed Apr 16 15:22:31 EDT 2008 | jdengler
This looks like it didn't solder the bottom side completely. The recipe for the reflow oven was not right and you did not hit a high enough temp at these locations to get a good solder joint. Then you saw the problem when you soldered the topside.
Electronics Forum | Wed Apr 21 12:03:59 EDT 1999 | Michael N.
I'm having problems with trying to get a good solder joint using a Ceramic PCB. We are using AMTECH hi-temp solder (ws-486 96.5/3.5ag). My profile looks great and I used the recommended profile from Amtech with a few adjustments. My max temp is about
Electronics Forum | Wed Apr 21 22:15:12 EDT 1999 | Chris
| I'm having problems with trying to get a good solder joint using a Ceramic PCB. We are using AMTECH hi-temp solder (ws-486 96.5/3.5ag). My profile looks great and I used the recommended profile from Amtech with a few adjustments. My max temp is abo
Electronics Forum | Wed Jul 12 11:26:12 EDT 2006 | flipit
Hi, I believe you have classic gold imbrittlement here. With 80 microinches of gold you are way over the limit. You can try to reflow longer time and at a higher temperature. The gold does not melt into the solder joint. The gold dissolves into
Electronics Forum | Sat Aug 28 14:16:18 EDT 1999 | JohnW
Doug, Have you tried running the boards at an angle to the wave of between 15 - 30 degree's ? I've done this on a few boards to eliminate short's and I believe it will work on your problem very sucessfully. Best thing to do is get your wave solder c
Electronics Forum | Mon Jan 19 14:54:38 EST 2004 | cyber_wolf
How did you come to the conclusion that you are having a cold joint problem. Just by appearance ? As Dave stated if you have any of the metals that he listed in the joints they will appear to be dull and grainy sometimes. But... Dave, I will have t
Electronics Forum | Tue Aug 24 21:52:06 EDT 2004 | rose
recently I met one very interesting issue with my board and connector. substrate of the board is copper with immersion silver, pad size is about 3x1mm. we print lead-free paste on the pad, then put the connector on the paste. The board was reflowed u
Electronics Forum | Wed Aug 25 20:48:17 EDT 2004 | rose
Hello recently I met one very interesting issue with my board and connector. substrate of the board is copper with immersion silver, pad size is about 3x1mm. we print lead-free paste on the pad, then put the connector on the paste. The board was refl
Electronics Forum | Tue Aug 24 15:05:39 EDT 2004 | Dreamsniper
There is danger in doing this based on theory. Chances of the solder joints becoming cold or having poor wetting due to the fact that during the first run all the flux vehicles had evaporated and with the second run they're no longer present to help
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