Electronics Forum | Tue Aug 07 15:25:04 EDT 2012 | joeherz
It looks like the inside of the barrels on these holes are not plated. Check some raw PCBs and see. If not, solder isn't going to flow to the top or make anything resembling a good solder joint.
Electronics Forum | Thu Aug 26 13:09:08 EDT 1999 | Doug
I am building a board with T1/34 LED's in a 10X10 array there are 12 arrays in a panel. The LED's are body to body in the array, .1 spaced. The LEDS have been autoinserted on a Universal RAD III, so they are cut and clinched. The trouble I am having
Electronics Forum | Thu Feb 18 17:06:33 EST 1999 | Dave Jurena
| Hope some of you out there can help me with this one. | I am getting feedback from our test department that they are showing opens on solder joints which have visually good wetting. The touch-up operators confirm that the joint looks good. All they
Electronics Forum | Wed Jul 28 22:06:17 EDT 1999 | Dave F
| Looking for solder paste specification limits which have reliability data to support them. Currently, we are looking to define the min/max volume necessary to ensure a good joint on CBGA, PBGA, and Micro-BGA's. Any information will be greatly app
Electronics Forum | Fri Nov 25 12:12:46 EST 2005 | pjc
To state whether an oven can or cannot "do lead free" very much depends on what type of product you need to solder. High thermal mass products are problems for 4 and 5 zones ovens becauase they typically cannot follow the solderpaste mfrs. profile, u
Electronics Forum | Tue Aug 23 12:13:02 EDT 2011 | richieoreilly
Hi, We are currently having issues with hand soldering High melting point solder wire. Can anyone give a few tips. We are Preheating boards to 120 deg C and using soldering irons @ 410 deg C. The quality is ok but the ts taking 20-30 seconds to c
Electronics Forum | Tue Sep 14 14:07:45 EDT 2010 | grahamcooper22
Hi Gani, HASL is normally very good for solderability providing there is a good consistent coating of HASL on the pcb pad. But it is not unusual to have a very thin coating of HASL on the pad and this is poor for solderability. You then have tin/copp
Electronics Forum | Fri Oct 10 05:57:20 EDT 2008 | leeg
Anyone use AOI instead of final inspection for analysing joint quality? If so any good?
Electronics Forum | Tue Oct 26 08:17:54 EDT 1999 | William
Dave, Last question(s). What do I do about a gold porosity problem? Dave: How would I approach the board house to check for this? They use a very well known chemistry, but is that where the pblm lies? Or would it be in their process, cycle times
Electronics Forum | Fri Apr 29 13:29:41 EDT 2005 | russ
I have always been nervous with this process. I fear that the "good joints" may become fractured without coming loose. I am a proponent of this to verify a profile or something to see the strength but then we always reflow the affected joint afterw
