Electronics Forum | Tue Sep 26 18:29:15 EDT 2006 | stepheniii
Profile, profile, and profile. If you can sacrifice a board, the best is to drill a small hole into the a ball from the other side of the board and insert a thermocouple there. I'm 99.99% certain you won't be able to sacrifice a board. (who can the
Electronics Forum | Wed Aug 09 09:54:36 EDT 2006 | russ
Use ENIG, plated finish will be too thick and make for a brittle joint. ENIG is self limiting so this condition cannot be present. To ensure that the bond is strong for BGA you must ensure that process is under control. The correct reflow profile w
Electronics Forum | Wed Oct 02 15:20:55 EDT 2002 | Eric
Is there a steadfast rule of thumb for a good solder joint on an Enig Gold board. I come across this number 217C when discussing BGA profiles. Is this a published number? I sure could use a reference. Anybody feedback is appreciated.
Electronics Forum | Fri Nov 19 13:46:14 EST 2004 | Dreamsniper
I used ASSCON VP450 with Galden 205 Fluid. It worked fine. Good Solder Joint Quality. I'm not promoting the product just sharing what I had.
Electronics Forum | Thu Jun 16 08:41:45 EDT 2005 | ghenning
Hi Fred, Were you able to develop enough confidence with the AOI to eliminate manual visual inspections and save money/time? How did you manage this and still get good solder joint quality? Thanks, George
Electronics Forum | Tue Jan 20 17:12:25 EST 2009 | smt_guy
Thanks guys. They are seen on some of the pads too. What will happen if I continue to solder them and I got a good solder joint formation? Will the pad continue to erode or corode in due time? or the solder that will recoat its surface will prevent
Electronics Forum | Mon Feb 15 17:57:01 EST 1999 | Earl Moon
| Hope some of you out there can help me with this one. | I am getting feedback from our test department that they are showing opens on solder joints which have visually good wetting. The touch-up operators confirm that the joint looks good. All they
Electronics Forum | Tue Oct 13 18:28:51 EDT 1998 | Graham Naisbitt
Upinder, Using IPA does not cause the residue, it simply exposes it. Given that all fluxes leave reisdues, it follows that these MUST be benign - but how do you know, and how do you control it. You are using flux to remove oxides and give you a go
Electronics Forum | Tue Sep 25 12:00:21 EDT 2012 | kkay
Thanks for fixing the picture. What you are looking at is a pad that the part was pried off of after reflow. The right side of the pad shows a good solder joint and underneath the part is where the voids occur. The outter solder joints show no voids
Electronics Forum | Fri Feb 11 05:43:21 EST 2000 | Wolfgang Busko
Hi Russ, I thought about it and what approach I would do. All that talk about causes and reasons doesn�t solve the problem. To determine wether it�s the PCB, the component or the process I would take a bare board, a component ( and maybe a different
