Electronics Forum | Fri Jul 30 15:22:52 EDT 1999 | M.L
| Looking for solder paste specification limits which have reliability data to support them. Currently, we are looking to define the min/max volume necessary to ensure a good joint on CBGA, PBGA, and Micro-BGA's. Any information will be greatly app
Electronics Forum | Thu Oct 25 04:52:17 EDT 2001 | Vai
I'm running intrusive reflow. What happened was when the board went thru' the first reflow ( which is secondary side ), at Post reflow, I can see the solder joint quality is very good smooth and shiny. But when we proceed with the 2nd reflow, at Post
Electronics Forum | Fri Feb 15 15:37:35 EST 2019 | emeto
Hello, I have a capacitor that doesn't form intermetallic joint with SAC 305 solder paste.The board is ENIG. Solder melts and forms good intermetallic joint with the PCB finish. However, capacitor can be removed with physical force - it looks like a
Electronics Forum | Thu Feb 24 00:37:08 EST 2022 | joshsvoboda
I have a pcb with an ENIG finish that is using a 144 pin LQFP and being soldered withSN100C/NC258 T4 paste. I used a oven profiler where the probes are taped down to the joint and the profiling software adjusts the program for the best profile for
Electronics Forum | Fri Aug 27 14:38:54 EDT 1999 | Doug
Brian, Thanks for the input. The hole size is good but the anular ring is small. I have helped the condition by reducing the clinch on the LED's. This I believe is reducing the pull out path. Thanks again | If your through holes are overlarge or th
Electronics Forum | Tue Sep 25 14:38:05 EDT 2001 | nwyatt
1. SRT has been recently calibrated - problem is too many hands in the machine and careless mistakes. The profile is good and has been recently checked by a fellow from Genrad. 2. We are relying on the left over solder from the previous joint and
Electronics Forum | Tue Jun 28 12:12:17 EDT 2005 | Paul
I'm with DaveF on this one. I think you'll be trying solve this one for a long time. Alloy42 just doesn't like to be soldered. What exactly is the issue? Lack of a toe fillets at on the cropped lead? There is no spec for a toe fillet other than to
Electronics Forum | Wed Jun 05 17:13:58 EDT 2002 | Yannick
Hello! I have a strage problem, we made some production with uBGA, BGA, 0201, 0805, and other type of component. We didn't put the uBGA and 0201 and BGA on the board at the end of the line we look a our solder joint and surprise the solder made a
Electronics Forum | Tue Feb 16 12:14:12 EST 1999 | Gregg Reick
| Hope some of you out there can help me with this one. | I am getting feedback from our test department that they are showing opens on solder joints which have visually good wetting. The touch-up operators confirm that the joint looks good. All they
Electronics Forum | Fri Jul 30 15:41:16 EDT 1999 | M.L
| | Looking for solder paste specification limits which have reliability data to support them. Currently, we are looking to define the min/max volume necessary to ensure a good joint on CBGA, PBGA, and Micro-BGA's. Any information will be greatly a
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