Electronics Forum: good joints (Page 9 of 101)

Pin-to-paste

Electronics Forum | Fri Apr 30 05:03:37 EDT 1999 | Hon Choi

Hi all, We're starting up tests for pin-to-paste and, well, things could be better. We're testing different pastes and we're testing different apertures rules and, well, we're still testing. It's coming close and we're getting pretty good joint no

Profile control parameters

Electronics Forum | Tue Jan 21 11:03:15 EST 2003 | MA/NY DDave

Hi You already received good answers. A thing to remember is the components and the PCB. How high you go above 63/37's 183C should be limited to create a good solder joint. Too long creates problems since the components and the PCB start to be he

Selective soldering justification

Electronics Forum | Thu May 12 11:56:42 EDT 2005 | pr

Ersa Versaflow has a nozzle we use for soldering 70 pin connectors, with smt parts 3mm from the leads. As far as soldering through hole (without the tight SMT parts)It's reliable, easy to program and very good quality joints. Your advantages are spee

Re: Wave solder mystery

Electronics Forum | Fri Aug 27 13:34:25 EDT 1999 | Brian Larson

If your through holes are overlarge or the anular rings too small, the surface tension of the wave may exceed that of the joint. I would look at the design. You may want to put a strip of kapton tape on the following edge of the panel to test the "

No-Clean or water

Electronics Forum | Sat Jun 09 14:28:58 EDT 2001 | Kelvin

No-clean solder paste is definately a trend for tomorrow. However, there are several points you need to consider before you shift from WS to no-clean: 1. Component quality - No-clean solder paste generally (not essentially) get a lower avtivity than

AOI: Comparisons

Electronics Forum | Tue Aug 31 02:15:12 EDT 2004 | AOI Solution

I need to address the issue for colorful display on solder joints, for whoever researched on this machine, no one can deny it is a smart feature for visual assistance. however, it is still Mono color "gray scale" algorithm. it basically "paint" the i

Imm Silver and Voiding

Electronics Forum | Wed Jun 28 16:16:09 EDT 2006 | Gman

Good article. Would EDX analysis of the cross-section at the void joints be a good method to determine any plating contamination or solder mask issues?

facing cold joint problem

Electronics Forum | Sun Jan 18 10:13:59 EST 2004 | davef

Materials added to solder can change its appearance. For instance: * Gold in tin/lead solder is dull / grainy * Palladium in tin/lead solder is dull / grainy We do NOT advocate using visual appearance to define the appearance of a good and a bad so

solder ball

Electronics Forum | Wed Jan 01 22:19:33 EST 2020 | sssamw

Solder ball attached on solder joint without violation minimum electrical clearance is acceptable. If your process parameter including stencil not changed, suggest you check if solder pasted being pushed out after IC placement, also check if solder j

Pasteprinter | unffilled Pads

Electronics Forum | Fri Oct 20 21:26:49 EDT 2023 | dwl

I agree with Sr. Tech. What does the reflowed joint look like? Is there an actual defect in the solder joints? If its good, I wouldn't worry about the print not being text book perfect.


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