Electronics Forum | Mon Jan 24 06:19:04 EST 2011 | fönsi
Hello! I've had the same problem about one Jear ago. We had exessive building of voids in the solder joints. I recomment to take a pincer to break off some of the components. If the solder joint is good, the copper pad will stay at the solder joint
Electronics Forum | Mon Jan 20 03:59:27 EST 2003 | emeto
Hi Burb, I think you should try with paste which consist Ag.Or it might be other:Ag has different thermal characteristics, so you probably stay too long in the reflow zone.That's one reason for granular joints. good luck!
Electronics Forum | Thu Mar 24 19:17:43 EST 2005 | EA
Hi, We are running the automotive product and question was throw to us how do we ensure that our solder joint are good enough after reflow.....and during the sealant process, there's a bit of bend on the nozzle and it toughes the component and custo
Electronics Forum | Fri Feb 21 19:49:36 EST 2003 | MA/NY DDave
Hi Good Luck Neil, When I first saw this process described, what you are experiencing was my first visual thoughts. Partial filling as well as huge solder voids inside of the joints. I figured for low reliability product or short life maybe this t
Electronics Forum | Wed Sep 05 07:07:25 EDT 2007 | mun4o
hi, I have a big problem with soldering uP QFP144 package.All components in PCB are small, only this chip is big and I can't make good temperature profile.Solder joints of other components are shining and with good wetting, but in QFP leads solder j
Electronics Forum | Thu Aug 20 18:11:53 EDT 2009 | smt_guy
Hi davef, thanks again for that enlightenment. I'm just curious about what's happening with the solder joint of the said process. Again to add to my unending queries for now: So on top of that copper is a thin layer of lead-free solder composition
Electronics Forum | Wed Oct 11 09:23:06 EDT 2000 | Roger Squires
Has anyone had any success in finding open circuits (i.e. ball present but not soldered to PCB) under collapsible BGA's using an Agilent HP5DX x-ray tester and the BGA2 algorithm? Can anyone recommend an elongated pad design which produces the neces
Electronics Forum | Wed Jul 15 05:36:34 EDT 1998 | Stoney Tsai
Bare board solderability plays a significant role of forming good solder joint. Currently, I can not find any information about bare board solderability testing procedure or methods. I think the procedure of testing should have some differentiations
Electronics Forum | Mon Dec 13 06:21:14 EST 2004 | Peppe
I work in electronic industry and I'm interested about the standard values of FIT (failure in time or useful lifetime) of soldering. In essenze my question is : how much time can work a good solder joint, before became fail ? Exist a minimum and ma
Electronics Forum | Thu Aug 03 09:05:09 EDT 2006 | Rob
We used to do point to point through hole soldering with robots. OK for medium to large volumes, but we did have to develop customer holders for each product. Quality was good - every joint was programmable for tinning, preheat, temperature etc, a
