Electronics Forum | Thu Jan 20 13:56:51 EST 2022 | stivais
For me it seems that the board is already assembled & soldered. Before assembling the board had been (poorly) washed (misprint perhaps) and the spots are just melted solder paste. Aren't those solder balls in the grooves between the pads and solder
Electronics Forum | Fri Jan 21 12:36:52 EST 2022 | stephendo
Like I said a lot of people don't tape the gold fingers the first time they run them. After that they make sure the fingers get taped up because solder gets places you don't think it does and once it touches gold, that gold is contaminated. How do y
Electronics Forum | Wed Jan 21 16:55:22 EST 2004 | patrickbruneel
Hi, Are you testing bare boards or soldered boards. Are the test probes in contact with soldered pads or contacting the copper with the osp coating (not soldered). If you could clarify this it would be easier to give some hints for probable causes.
Electronics Forum | Fri Jan 21 06:35:51 EST 2022 | stivais
"Manual washing" of a misprint board basically is smearing of printed solder paste all over the board. And trying to remove (wipe off) it afterwards. So for me it would not be any surprise that the solder paste ended up on the pads where it was not i
Electronics Forum | Fri Jan 28 13:49:48 EST 2022 | jseewald
That is correct. This looks like a board that was printed then wiped but not washed. Solder spheres left out on an unsolderable surface will just sit there like this or coalesce into solder balls. Nothing in the picture indicates an issue with the
Electronics Forum | Thu Jan 20 21:37:18 EST 2022 | charliedci
I agree it looks like that, but no solder has been on this area. We are asking the board house to get their input.
Electronics Forum | Thu Sep 30 15:46:22 EDT 2010 | vetteboy86
Hi Folks, I'm looking for detailed information about the different composition of circuit board pads. We have been experiencing some issues with our solder, and I would like to know the differences between compositions. I do know that we ran a cust
Electronics Forum | Wed Jan 21 17:43:04 EST 2004 | Kris
Hi, I had the same question. In our case we are contacting the copper with the osp coating (not soldered). any published reports that we can reference Thanks
Electronics Forum | Thu Jan 22 09:21:45 EST 2004 | davef
Oh, another thing, we do not like to probe copper. It's hard, compared to solder, and beats-up the probes too much. [As Patrick Bruneel states in this thread.] Consider reflowing paste on your test pads.
Electronics Forum | Mon Oct 04 11:34:29 EDT 2010 | vetteboy86
I've done minimal research to this point and understand my issue with solder on the double sided boards is due to oxidation that occures on the unpopulated pads when the board makes its first trip through the reflow oven. We did run both sides in a
