Electronics Forum | Sun Jan 18 10:13:59 EST 2004 | davef
Materials added to solder can change its appearance. For instance: * Gold in tin/lead solder is dull / grainy * Palladium in tin/lead solder is dull / grainy We do NOT advocate using visual appearance to define the appearance of a good and a bad so
Electronics Forum | Mon Jun 11 21:56:41 EDT 2001 | davef
Continuing, I�ve optioned about the uselessness of shear testing of solder connections on this forum previously. So, the points that you make about the elusiveness of developing a standard for measuring solder connection strength is well taken. I�l
Electronics Forum | Mon Jan 19 14:54:38 EST 2004 | cyber_wolf
How did you come to the conclusion that you are having a cold joint problem. Just by appearance ? As Dave stated if you have any of the metals that he listed in the joints they will appear to be dull and grainy sometimes. But... Dave, I will have t
Electronics Forum | Fri Jul 26 08:25:25 EDT 2013 | emeto
If there is a way to pre-tin the parts, that might help in forming better joint with gold.
Electronics Forum | Thu Jul 29 21:11:13 EDT 2004 | davef
Could be lots of things. With limited information about temperatures, solder alloy, and cleaning; we'll swing for the fence that you got these solder connections very hot. So hot that Pb oxide is dominating the solder joint surface instead of the
Electronics Forum | Fri Jul 26 05:14:38 EDT 2013 | anilw2006
We had a solder joint problem in gold plated PLCC68 ic. We do double sided reflow process with Cookson OL107F paste. First we do top with paste and second with glue process.The solder joint shape and wetting looked normal.In the process of testing
Electronics Forum | Thu May 26 21:09:01 EDT 2005 | thaqalain
The reliability of a Gullwing component solder joint is in question when insufficient solder is evident: *at the heel of the lead *at the toe of the lead *none of the above
Electronics Forum | Wed Jan 16 11:20:52 EST 2002 | bentzen
Hi... We tend to do a lot of footprint calculating for new SMD components. But what about the amount of solder paste on the solder pads. The amount of solder alloy is of cause determined by the stencil aperture size, stencil thickness and the sold
Electronics Forum | Wed Jan 16 12:04:45 EST 2002 | dason_c
You can use the IPC-7525, Stencil Design Guidelines for start up.
