Electronics Forum | Thu Aug 24 15:37:50 EDT 2006 | Chunks
Hi Any, This is from an earlies thread "Solder Ball After Reflow Process". Date: August 16, 2006 01:52 PM Author: Russ Subject: Solder Ball After Reflow Process Oven settings are meaningless here. What does the board see? It is the paste we a
Electronics Forum | Wed Sep 26 12:16:44 EDT 2012 | bwjm
Hi Guys,recently i am facing an issue. Refer to the attached photo. This PCB is high RF speed, gold immersion single layer. After reflow, my solder seems to have black stains on it. I tried with SAC305 paste water soluble and no-clean, both results a
Electronics Forum | Fri Apr 29 14:16:16 EDT 2011 | ppcbs
Below is the long explanation. This defect is most commonly found with BGA components, but can arrise with all components. I see it happening more now with lead free boards that are being assembled with a no clean flux. Best short term remedy is t
Electronics Forum | Sat Jun 27 10:45:18 EDT 2020 | SMTA-Davandran
Hi Indhu, Check for solder paste height. Please manually add solder, mount component and reflow.
Electronics Forum | Sun Feb 06 12:04:06 EST 2005 | ddhanashekar
can some one give me some suggestion to solve the problem. we are using cooksun/alphametal rma9086 paste for our screenprinting. after the reflow we see lot of solder ball on the board. we have maintained the exact profile given by the manufacurer. w
Electronics Forum | Fri Jun 26 14:08:49 EDT 2020 | indhu
Hi, I am having a issue that SMT nut drop after reflow. The solder height all in specifications. Had tried adding flux inand the solder paste. But shows no improvement. Is the nut easily oxidize? Can anyone help me on this?
Electronics Forum | Thu Dec 09 07:21:10 EST 2010 | scottp
You won't have 2 mil height because the solder doesn't remain brick shaped. It's a dome. In the past I tried doing some calculations using the formula for the volume of a spherical section and also tried using a simulation program that accounts for
Electronics Forum | Mon Feb 07 12:47:18 EST 2005 | Indy
1. use 6-7mils stencil. 2. reduce aperture opening to 60-70% of pad size. 3. check viscosity of solder paste. According to that you might want to alter your print speed and pressure. Cheers Indy
Electronics Forum | Thu Jun 27 08:12:17 EDT 2019 | SMTA-John
If the case shield is solderable, add pads to the edge of the two through holes and paste . This wetting should hold it in place.
Electronics Forum | Thu May 05 08:14:45 EDT 2011 | kahrpr
Where black pad exists, it is not a common problem. When I read it is totally random I doubt that. You have defiantly something going on that is unique with the process. It is either your board manufacturer or your solder paste or your profile. It c
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