Electronics Forum | Wed Aug 04 14:32:02 EDT 1999 | Barney Whalen
| Hi all, | | What is the typical placement head pressure for the GSM1 for placing the micro / chip Scale BGAs ? | | Thanks | Upinder | ======= | Hello Upinder, The typical placement pressure for a GSM1 with Flex head is 150-170 grams. You can p
Electronics Forum | Wed Mar 28 11:29:49 EST 2001 | gcs
I've used below: WEIGTH OF COMPONENT IN GRAMS ---------------------------- TOTAL PAD MATING AREA IN SQUARE INCHES GRAMS PER SQUARE INCH MUST BE EQUAL/GREATER THAN 30 FOR SECONDARY MOUNTING.
Electronics Forum | Thu May 22 01:37:31 EDT 2008 | azimi789
I found out that the light is not heterogeneous, i am trying to solve this problem... from my web surfing I encountered an article that claimed there should be 200 grams Placement Pressure on the BGA while soldering ... is that really needed? 200 gr
Electronics Forum | Tue Jul 20 08:30:07 EDT 1999 | Mark Quealy
I recently switched from solder paste in 500 gram jars to 500 gram tubes. I did this to try to limit the time the paste is exposed to the room environment. But we have a need to clean the stencil every 4 - 5 boards which means taking the bulk paste l
Electronics Forum | Tue Jul 20 17:24:24 EDT 1999 | Deon Nungaray
| I recently switched from solder paste in 500 gram jars to 500 gram tubes. I did this to try to limit the time the paste is exposed to the room environment. But we have a need to clean the stencil every 4 - 5 boards which means taking the bulk paste
Electronics Forum | Tue Nov 05 21:10:56 EST 2002 | jonfox
Typically the more you buy (by volume) the cheaper it is per gram.
Electronics Forum | Thu Jun 05 12:15:51 EDT 2008 | cyber_wolf
We have hand mixed several million grams of solder paste in the last 20 years. No problems to date.
Electronics Forum | Wed Aug 16 03:04:50 EDT 2000 | rberry
Hi Does anyone have a tried and tested method of estimating the mass of solder paste that will be used for an SMD assembly given only the type and quantity of components used. (As well as type of paste, stencil thickness etc) In other words is there
Electronics Forum | Mon Aug 09 08:16:44 EDT 2010 | markhoch
It will most likely hold on. There is a formula that you can use if you're uncertain. It's (weight of the component in grams)/(total pad mating area in square inches) Grams per square inch must be less than or equal to 35 for the component to be mo
Electronics Forum | Wed Aug 25 15:54:46 EDT 2010 | blnorman
I previously did a search on "peel back force" > and there were a few results, and there were a > few hits that say EIA-481 is the standard, but > nothing on what the standard force range is. A > search on "cover tape" yeilds many hits about >
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