Electronics Forum | Thu May 26 21:21:36 EDT 2005 | thaqalain
The non-metalized part,or non-leaded part of any electronic component is called *Termination *Lead *Body *Heel
Electronics Forum | Fri May 27 02:42:17 EDT 2005 | Base
... I guess I'm the one who's thick-skulled... Looks like your posting an entire exam or something?! ...
Electronics Forum | Fri May 27 04:20:05 EDT 2005 | Rob
A please & thank you wouldn't go amiss either.
Electronics Forum | Sat May 28 13:40:35 EDT 2005 | I'll be back
Sorry for to many (or less ) that. Which is by the way soon obsolete (DAT that is).
Electronics Forum | Wed Aug 25 22:15:44 EDT 2004 | mmk
During BGA rework we are asked to protect adjacent compoennt from secondary and/or partial reflow. That is our normal process. However, the customer is asking that the peak temp of the joint at the adjacent component should not exceed 160C. Can you p
Electronics Forum | Fri May 27 08:24:25 EDT 2005 | siverts
Ehh?? Are we going to win a prize if we give the right answer? Do You know the right answer? I'm sorry but I don't understand the posting. Regards,
Electronics Forum | Sat May 28 13:36:52 EDT 2005 | I'll be back
Hmm, let say that that You have a huge body who takes the lead, with no heels and not properly grounded to the earth; T1 or T2?
Electronics Forum | Fri May 27 02:39:45 EDT 2005 | Base
Hate to say it but I'm gooing to anyway: buy a book and get a course!!! I understand your need for information, but most (if not all) of your questions concern very basic knowledge. I appreciate your needs, but by posting ALL of these questions the
Electronics Forum | Thu Mar 16 10:28:34 EST 2000 | Ashok Dhawan
I am looking for a general guidelines on a standard format of component description. Being contract manufacturer , we do come across various components from various customers. Everybody is different , one way or other. That create a lot more prob
Electronics Forum | Mon Nov 26 20:11:41 EST 2007 | shy
Yes, i'm agree with you davef but i'm not put the chipbonders onto pads. i'm put the chipbonders at the beneath component (center between both component terminals) which the idea is to hold the component during wave soldering which might cause the co
