Electronics Forum: ground design (Page 1 of 14)

Placement of 32 pin QFN w/t ground pad

Electronics Forum | Fri Oct 09 00:57:05 EDT 2009 | jjmag921612000

SteveO, I had personal experience with this using a Panasonic MPAV2B. It took a while, but I believe the end result was to have some additional "Z" travel to press the QFN into the paste. Also, the design of the paste on the ground was key to keep t

Stencil design

Electronics Forum | Thu Mar 08 18:39:06 EST 2007 | elias67

Stencil Thickness should be .005" A reduction along with cross hatching is a must for the center pad to reduce paste volume as well as to assure even paste deposit while printing on a large pad. With out the cross hatch, the squeegie will most like

Soldering to thru-hole lead to ground plane without thermal relief

Electronics Forum | Fri Jun 16 10:38:33 EDT 2000 | Iain

I have 15 very large backplanes (.156" thick Au plating) that the ground pins of a high density thru-hole connector were not thermal relieved in the artwork. As a result we are unable to solder the 8 pins that connect to the ground plane. We know t

Chip Components with big ground pads - Unsolder

Electronics Forum | Wed Jan 28 20:58:16 EST 2004 | davef

Vinny: From a thermal standpoint, your choices are: * Get your customer to design thermal relief in the board. * Set your thermal recipe to assure that the grounded pad reaches reflow temperature. This may require a long soak at a single temperature

Chip Components with big ground pads - Unsolder

Electronics Forum | Mon Jan 26 03:45:37 EST 2004 | Vinny

Hi All, We are producing a veriety of RF related PCBAs in which we see Unsolder/Mislaigned on a regular basis. In these baords usually one of the pad is connected to a signal trace and the other pad is connected to very huge ground plane. This gro

Chip Components with big ground pads - Unsolder

Electronics Forum | Thu Jan 29 00:10:17 EST 2004 | Vinny

Hi Dave, Thanks for your reply. I have tried getting the design changed from the customer but they cannot provide thermal relief as this changes the RF performance and they cannot afford to do that. As for profile it does reach the reflow tempera

Nordic aQFN73 stencil design

Electronics Forum | Wed Apr 18 14:17:48 EDT 2018 | esoderberg

Further divide the ground block into more than 4 panes. Also think about using, assuming you have good placement of using Loctite chip bonder on two opposing corners. Lots of ways to get good results

This design is for??

Electronics Forum | Sun Apr 08 20:42:21 EDT 2007 | Tom

1. Resistor is used to provide ground return for diodes. Diodes have a capacitance and with them floating a charge can build up. 2. They each perform different functions. The 100N is used for HF filtering. The 1uf is used for LF filtering and

stencil design software

Electronics Forum | Wed May 22 02:35:26 EDT 2002 | ianchan

hussman, hi, mebbe we get the stencil fab house guys who spend more time in the workshop making more stencils = more revenue, whereas your stencil fab house is more learned and refined? we make it a point to use an inhouse MS-Excel format to key in

Help with PCB design

Electronics Forum | Wed Jan 30 15:46:32 EST 2013 | davef

First, look here [http://www.ti.com/lit/ug/snva500/snva500.pdf ] This is the actual pdf from TI, not some cheap-ass reproduction, like the link you gave us. Orange polygons [and other shapes] - copper covered with ENIG * On the edge of the board, bo

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