Electronics Forum | Tue Sep 01 02:50:40 EDT 1998 | karlin
| We are experiencing shorting on a BGA. The part has a 1mm pitch with a 196 I/O count. The problem seems to pop up without warning & disappear in the same manner. | Our pad design is .020" diameter pads with .025" solder resist diameter. The ce
Electronics Forum | Thu Oct 05 10:37:10 EDT 2006 | David
Hello all, We have problem with voids in one of our product. We are soldering IC (package SO8) with under the components grounding connection. The ground pad for this component has 3 via holes (before producing we have to cover this 3 holes from b
Electronics Forum | Mon Nov 12 19:02:48 EST 2012 | jmartens1978
My first attempt was similiar to that. It was a straight ground trace running past the circular pads that were recieving the shocks. It was hit and miss when the arcs would occur. When I cut notches in the trace so the ground line had a point next to
Electronics Forum | Mon Sep 20 11:21:48 EDT 2010 | tony1
I have this NiPdAu small QFN packge sizes less than 2x2. I tried to do solderability Dip And Look test and there's always some units no wet on either ground pad and small I/O. Can someone help to explain why is this so difficult to set on this surfac
Electronics Forum | Sun Sep 30 09:50:18 EDT 2012 | rgduval
We believe that Dave's analysis above is mostly accurate. Run a board with no components, and check for voids. We'd also like a little more information, though, to clarify. What type of component is experiencing the voiding? You describe the void
Electronics Forum | Fri Oct 03 05:59:20 EDT 2014 | cmchoue
Does anyone well know in "via hole design in ground pad" I have few question that i want to know the answer,thanks. 1.Thermal performance compare about a.Via Full Stuff (top/bottom:solder mask and inside is air) b.Via Half Stuff (bottom:solder mask
Electronics Forum | Mon Jun 24 10:19:23 EDT 2019 | slthomas
I have not added images in quite some time but the "Attachments" feature below the window where you type your post will steer you through it. You just have to have the image hosted someplace that you can point to. Just for
Electronics Forum | Thu Jul 20 23:41:55 EDT 2017 | heros_electronics
Below is an email that I copy and pasted from my customer's engineer about his concerns with the issue of the chips not reflowing (which is why I was asking about X-ray the chips to make sure they reflowed): Can you let me know your thoughts on his
Electronics Forum | Mon Apr 09 16:48:27 EDT 2007 | ratsalad
How wide are your pads? What paste are you using? What is your board finish? Could you please post a link to the datasheet for the component? We place a lot of MLFs, both in a Pb and Pb-free process. Our standard stencil design for MLF compon
Electronics Forum | Wed Nov 15 12:52:21 EST 2017 | georgetruitt
IMO – Look into nano-coatings for your stencil and radius all square apertures This should help out with solder paste releasing from the stencil helping with insufficient solder QFN LGA aperture design, try a stencil cut with a few different apertur
