Electronics Forum | Thu Jan 22 12:21:54 EST 1998 | Michael Allen
Is there a standard (JEDEC or other) for "lead sweep" errors on fine pitch (eg, 0.5mm) gull wing leads? Parts from one of my suppliers has a sweep error up to 6 mils; the mechanical drawing does not address lead sweep error, nor is there a true posi
Electronics Forum | Fri Dec 20 17:09:52 EST 2019 | slthomas
I agree, that is not a gullwing lead in the normal sense but that doesn't address the failure. The wetting looks fine unless there is a problem under the lead, which is hard to tell since there is an obvious fracture. That appears to be the edge o
Electronics Forum | Tue May 02 14:56:57 EDT 2006 | Tim
8.2.5.5 Flat Ribbon, L, and Gull Wing Leads, Maximum Heel Fillet Height (E). For class 3 the heel fillet cannot touch the body of a plastic component, except for SOICs and SOTs. Why is my question? What type of failure will be the result of solder
Electronics Forum | Mon Jul 29 08:34:40 EDT 2013 | gallionc
I don't see an issue. As was mentioned before, it is what the customer wants. You could approach this from one of two ways. You could simply install the parts, clinch the leads on the opposite side for added mechanical strength and solder the parts
Electronics Forum | Sun Dec 10 11:55:16 EST 2000 | Bob Willis
The following may be of interest to you. INTRODUCTION TO X-RAY INSPECTION All text Copyright Bob Willis, EPS INTRODUCTION TO X-RAY INSPECTION The use of X-ray inspection is becoming very popular due to the increased use of Ball Grid Array (BGA)
Electronics Forum | Sun Dec 10 11:55:28 EST 2000 | Bob Willis
The following may be of interest to you. INTRODUCTION TO X-RAY INSPECTION All text Copyright Bob Willis, EPS INTRODUCTION TO X-RAY INSPECTION The use of X-ray inspection is becoming very popular due to the increased use of Ball Grid Array (BGA)
Electronics Forum | Sun Dec 10 11:56:05 EST 2000 | Bob Willis
The following may be of interest to you. INTRODUCTION TO X-RAY INSPECTION All text Copyright Bob Willis, EPS INTRODUCTION TO X-RAY INSPECTION The use of X-ray inspection is becoming very popular due to the increased use of Ball Grid Array (BGA)
Electronics Forum | Fri Sep 15 16:37:49 EDT 2000 | Dave F
Sounds like someone aimin� fo tha big hurt, if ya axes me. Two spots to place your lawn darts are: 1 J Hwang in "Modern Solder Technology � " states (p.354) that " � extreme CTE mismatch between silicon IC (~2) and the PCB (~16), solder connections
Electronics Forum | Fri Jul 30 17:13:30 EDT 1999 | Dave F
| | | Looking for solder paste specification limits which have reliability data to support them. Currently, we are looking to define the min/max volume necessary to ensure a good joint on CBGA, PBGA, and Micro-BGA's. Any information will be greatly
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