Electronics Forum | Mon Sep 20 09:02:34 EDT 1999 | Wolfgang Busko
| Hi all, | | We have a little discussion here about the suitable flux for a certain process, as all of us are beginners we need your advice. | | We are producing VGA cards and mother boards for PC's all components to be wave soldered are TH, the S
Electronics Forum | Tue Sep 21 02:51:06 EDT 1999 | Mohammed saad
Thank you all for your help. about your question Wolfgang, I am using no-clean solder paste from Kester. Mohammed | | Hi all, | | | | We have a little discussion here about the suitable flux for a certain process, as all of us are beginners we ne
Electronics Forum | Thu Feb 10 17:33:43 EST 2000 | Ivan Rojas
I will just like to know if is ok to build a board with a BGA ,with water soluable paste and washed or is better to use a no clean paste . And one last question , what do you guys think about the better paste Kester or Indium .
Electronics Forum | Thu Feb 10 17:33:37 EST 2000 | Ivan Rojas
I will just like to know if is ok to build a board with a BGA ,with water soluable paste and washed or is better to use a no clean paste . And one last question , what do you guys think about the better paste Kester or Indium .
Electronics Forum | Tue Feb 01 07:50:25 EST 2000 | Jason Bentley
This all depends on the mixture of your solder. If you are using water soluable flux then it will get clean. But not alcohol based flux. As for using the ultrasonic this might be a problem I personally have never heard of someone washing a board in a
Electronics Forum | Mon Sep 09 13:46:34 EDT 2002 | dragonslayr
Your lack of obvious solder balls indicates you have a decent process. However, there are still small solder balls that are free and floating on the surface of the boards prior to wash. That same solder ball is washed off and ends up in the wash solu
Electronics Forum | Mon Sep 09 19:17:56 EDT 2002 | dragonslayr
steve- once again I mention that the lead that is actually in the water is in solution i.e. the lead is in a molecular form that has attached to a H2O molecule. To have a minimum of lead that is below the regulated ppm, there cannot be any chunks,
Electronics Forum | Fri Oct 08 02:31:07 EDT 1999 | Brian
| | | | Hi, | | | | | | | | Help! Could anyone help to enlighten me on this? | | | | | | | | Question: | | | | | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowab
Electronics Forum | Wed Oct 06 23:36:28 EDT 1999 | karlin
| | | Hi, | | | | | | Help! Could anyone help to enlighten me on this? | | | | | | Question: | | | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z
Electronics Forum | Wed Oct 06 08:41:42 EDT 1999 | Dave F
| | Hi, | | | | Help! Could anyone help to enlighten me on this? | | | | Question: | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a n
