Electronics Forum | Wed Mar 05 11:00:52 EST 2003 | msivigny
Hello Joseph, I'm sure there is an alternative but I need to have more information in order to make a suggestion. Is the part setup for selective soldering, through-hole for wave or surface mount for reflow? Let me know if you require additional assi
Electronics Forum | Wed Mar 05 22:37:11 EST 2003 | JOSEPH
Hello sir, The component is for surface mount reflow.It would dropped into the pwb slot during component placement if no support from underneath . RDGS
Electronics Forum | Thu May 11 21:15:01 EDT 2000 | Dave F
Cecep Wahyu: A fairly broad topic for an online forum, don�t you think? 1 People write books on plating. Buy one: "Electroplating: Fundamentals of Surface Finishing" Lowenheim, FA (0070388369) "Graham's Electroplating Engineering Handbook" 4Ed, Dur
Electronics Forum | Thu Mar 06 09:34:56 EST 2003 | msivigny
Hello Joseph, I'll be honest, I'm finding it a bit difficult to understand and visualize the complete scenario. If this component is designed for surface mount placement into a slot on a PCB, then why does it even need support from the bottom side? I
Electronics Forum | Wed Aug 11 18:36:03 EDT 2004 | davef
90 Knoop. Q2: Thickness is 4 to 10 u" for Au and 300 to 400 u" for nickel A2: This looks like a ENIG spec. Although, the Ni is quite heavy, 150 uin is sufficient for most applications. [IPC-4552 ENIG specification: * Gold thickness of 0.075 - 0.125
Electronics Forum | Wed Nov 18 14:42:22 EST 1998 | Dave F
| I heard somewhere that SMEMA has joined IPC, and that the association has decided to boycott Nepcon from | year 2000. Can anyone tell me if this is true | Nick: SMEMA and IPC are talking about merging (EP&P, 11/98, p 18). Below is a news release
Electronics Forum | Thu Dec 08 07:55:16 EST 2005 | davef
Your understanding of the situation is correct. In both cases, you solder to the nickel. The gold [Au] protects the nickel from oxidation. When soldering, the gold moves into solution in the solder and forms an intermetallic compound [IMC] with th
Electronics Forum | Tue Jan 11 09:47:01 EST 2000 | Dave F
Abbas: Sources of information on DFM/DFT are: � "SMTnet Express" articles on DFM by Earl Moon � IPC-D-279, 'Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies' � Books in SMTnet and SMTA book stores � Other examples ar
Electronics Forum | Tue Jan 16 20:34:17 EST 2007 | davef
DAVE�S BOOKSHELF ASSEMBLER�S ESSENTIALS Title: Soldering in ElectronicsAuthor: RJ Klein WassinkPublisher: Electrochemical PublicationsISBN: 090115024XPublication date: December 1989 I know, I know. The book was written in 1989!!!! I use this b
Electronics Forum | Sat Mar 06 08:26:59 EST 1999 | Dave F
| Clarissa, | | We place the parts using two different methods. One is using a Fritsch semi automated pick and place. The other is using a vacuum pen. One of the assemblers said if she just had to choose one, she would pick the vacuum pen. I kn
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