Electronics Forum | Mon May 14 09:43:37 EDT 2001 | orbotech
As the face of business changes through revolutionary factors, such as the increasing rate of outsourcing, manufacturers (especially EMS plants) will strive to fine tune their test strategies to ultimately improve and sustain product quality and to r
Electronics Forum | Wed Aug 31 08:27:45 EDT 2011 | rway
AOI if needed? I take it your AOI/AXI is not inline. Too bad. Our AOI is the first line of defense against induced errors in the mfg process. It's invaluable. How do you know it's not needed, or that it won't be needed in the future? Do you hav
Electronics Forum | Wed Apr 21 15:27:24 EDT 1999 | Murray Pulman
Hi Scotty sorry to stir things up but we assemble some seriously high value boards on a contract basis with vias through bga pads. However, not blind vias, so there are no cleaning issues & we use 6 though stencils to provide a little extra paste t
Electronics Forum | Thu Jun 06 07:28:30 EDT 2002 | cyber_wolf
It has been my experience that the only thing(s) that will ever cause this is: 1. Operators with paste on their hands. 2. Paste on the screen printer tooling. 3. Paste on the bottom of the stencil. Even very very small amounts of paste on the gold fi
Electronics Forum | Thu Jan 03 16:46:10 EST 2008 | ck_the_flip
Stainless steel can NOT be soldered with the solder that is used in electronics, be it Sn63 or SAC305. I have 1st hand experience in this. Solder will NOT wet to it no matter how much flux is applied, or what type of flux is applied. Again, I have
Electronics Forum | Mon Feb 27 17:08:15 EST 2006 | GS
3,5 ugr/cm2 NaCl) or power components, or Raw PCB. Nothing with the solder process or fluxes. Ion Chromatography analysis was necessary to help understanding of contamination origin. When occasionally we run TIC on a NC assembled PBA (Paste ROL0 or
Electronics Forum | Tue May 26 16:59:47 EDT 1998 | Gary Simbulan
I know, I've read the "been there done that" stories about this subject, but I still profess ignorance on some aspects. We are using NPO type dialectric caps in potted high voltage assemblies and continue to experience catastrophic vailures. Upon
Electronics Forum | Tue May 26 17:29:42 EDT 1998 | Earl Moon
| I know, I've read the "been there done that" stories about this subject, but I still profess ignorance on some aspects. | We are using NPO type dialectric caps in potted high voltage assemblies and continue to experience catastrophic vailures. U
Electronics Forum | Thu Jul 08 15:38:27 EDT 1999 | Earl Moon
| Thank you all for your replies. Thanks to your replies and backup from the IPC-SM-782A (section 3.6.3.2) and James Blankenhorn's "SMT Design Rules & Standards," the designer has agreed to provide adequate clearance between the via and the pad. |
Electronics Forum | Thu Oct 26 12:56:50 EDT 2000 | ptvianc
That is a tough question. I think that an important point must be made, and that is that the electronics assembly business is just that, a business. And, electronics asssembly companies are in business to make a profit. The profit, or "bottom line
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