Electronics Forum | Thu Feb 21 14:40:42 EST 2013 | hegemon
My own preference in this arena is towards the forced air convection style preheat, the key being the forced air. Radiant preheat is too slow for some, and IR preheat can have other issues that convection (or radiant) will not. Zephyrtronics has bee
Electronics Forum | Wed Feb 20 15:20:34 EST 2013 | hegemon
Depending on your requirements, you could range from a hair dryer, heat gun, toaster oven, hot plate, on up to digitally controlled surfaces and convective systems. You'll have to gauge for yourself whether you are just trying to add some heat energy
Electronics Forum | Fri Jun 01 10:43:43 EDT 2012 | signal
Perhaps apply the through hole part, solder mask only one barrel. Then hand solder that single leg.
Electronics Forum | Wed Sep 27 12:44:52 EDT 2000 | Ashok Dhawan
What could be possible resons for " Plating Crack on Barrel (tented via)" This tented via is in proximity to parts being hand soldered. The crack in barrel was detected on failure analysis - micro-section of via where barrel is having crack ( circul
Electronics Forum | Thu Jul 17 20:20:21 EDT 2014 | mac5
Hi June, The biggest issue with an OSP finish is as soon as the PCB sees a heat cycle (reflow or wave) the finish will begin to degrade. If you have a single sided SMT assembly with THT components installed downstream it works pretty good. But a dou
Electronics Forum | Thu Nov 17 20:23:55 EST 2005 | davef
We're with your customer. We believe inner layer separation is not linked to a heating excursion. What you are seeing is separation between the hole wall and the copper plating in the barrel of the hole on an unstressed PTH. Although, it's possibl
Electronics Forum | Thu Nov 17 15:40:23 EST 2005 | Hoss
We have a board that has been diagnosed with inner layer separation from the barrel wall. This board is .093 thick and 12 layers. Several layers, in some cases, have little or no thermal relief making soldering difficult. We have since switched t
Electronics Forum | Thu Dec 11 07:29:58 EST 2008 | jdumont
I have done a few studies on this issue here. As a result we have increased hole diameter on heavily ground planed pins to a min of .015" over the lead diameter as well as preheating the PCB when hand soldering. I have also had to order the upper pre
Electronics Forum | Mon Nov 27 17:33:25 EST 2000 | Dave F
Ramon: I guarantee you there is corrosion on the solderable surfaces of your board. The issues are: * Flux selected is capable of removing the corrosion at hand. * Processes for applying the flux and soldering the board are effective for the sele
Electronics Forum | Fri Jan 19 07:54:56 EST 2007 | realchunks
I believe you are describing a pin in paste process. Not sure where a stencil is involved. Depending on you machine/pump, you can do damage to it by running paste thru it. Paste is a metal and will wear out internal parts. Also, most pastes used
.png)
winsouce.jpg)
