Electronics Forum: hare (Page 1 of 2)

Re: pcb design for bga grounding.

Electronics Forum | Fri Aug 13 05:38:45 EDT 1999 | stefano bolleri

Ray, what about allowing everybody else to know about the "more info" ???? This is supposed to be a forum, isn't it? Bye, SB | Thanks for the reply, | i have sent you an e mail with more info in it. | thanks ray hare

can silver plating be used as barrier when soldering brass to copper? silver plate the brass?

Electronics Forum | Thu Jun 08 18:19:40 EDT 2017 | edhare

Jeff, You might look at this paper, which has some background & references that are relevant to your question ... http://www.semlab.com/papers/diffusionbarrierplatinginelectronics.pdf Ed Hare

QFN Side fillet

Electronics Forum | Fri Jul 19 13:09:55 EDT 2019 | edhare

Hi, Are you referring to the condition illustrated here? ... https://www.semlab.com/qfn-solder-fillets In this case, the solder was wicked down an attached un-filled PTH via. Ed Hare SEM Lab, Inc.

Au Thickness in ENIG PCB

Electronics Forum | Wed May 05 15:31:14 EDT 2021 | edhare

0.5 to 1 micron is typically too thick and can result in gold embrittlement of the solder joint. Typical IG thickness is 0.18 microns. see https://www.semlab.com/papers/gold-embrittlement-of-solder-joints/ Ed Hare

Nitrogen supply for new solder wave spray fluxer.

Electronics Forum | Wed Mar 08 12:22:29 EST 2023 | ccouture

we don't have a nitrogen generator installed yet. The solder wave supplier recommends 99.99%. we hare received several submissions for nitrogen generators that meet the requirements.

Coilcraft Inductors Open

Electronics Forum | Fri Aug 15 12:40:49 EDT 2014 | davef

Hi Dave, We can help. Please ask this consultant to contact us directly. There are a number of possible reasons and we'll have many questions to get to the root cause. We are always happy to help solve customer problems. Thanks and Best Regard

PTH Voiding Caused by Gold Plated Leads

Electronics Forum | Tue May 21 16:18:57 EDT 2019 | edhare

Interesting problem. I've seen this before on SMT device leads (see Gold Embrittlement paper at http://www.semlab.com). The AuSn4 IMC is solid at typical reflow temperatures and traps volatiles in the solder joint. One usually cannot crank the ref

Adhesive Dispersion Specifications

Electronics Forum | Mon Oct 21 09:58:28 EDT 2002 | cnoonan

We hare having an issue with our chip shooters misplacing or not placing parts all together. We have traced it back to our adhesive machine. We are using both single and double dot nozzles. I feel that the biggest problem is excessive amounts of g

SMT EQUIPMENT FOR LOW VOLUME HIGH MIX

Electronics Forum | Mon Apr 28 13:29:22 EDT 2003 | gregp

Possibly. It sounds like attrition is a contributor to your problem. Are you recieving the material with the tapes cut from the customer (consignment) or is this something you do in the kitting process? If you are doing it, how do you maintain prop

Re: Where can I get delmat material

Electronics Forum | Wed Aug 25 10:09:15 EDT 1999 | ray hare

| | Can anyone tell me where I can get a good lightweight material to use for a soldering fixture? I need to make various fixtures to hold LED's vertical during the soldering process, and keep them from floating up off the board surface. | | | | At

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