Electronics Forum | Tue Apr 27 15:57:44 EDT 2004 | Don Ackerman
We are a capacitor manufacturer. After crimping, we inspect the case length with digital calipers. The harsh environment (acid) destroys the calipers. Has anyone found chemical resistant measuring devices that will withstand this hostile environment?
Electronics Forum | Mon Jun 30 15:47:46 EDT 2014 | AK
Thank you SteveO, I have also tried reflow 2nd time without any problem, but I also do not know the impact of long term reliability as our devices are most likely operated in the harsh environment. We are currently do soldering in Argon environment.
Electronics Forum | Mon Jun 15 06:59:59 EDT 2009 | davef
Helloooo Germany. Innolot solder paste is a product for harsh environment vehicle electronics that Cookson Electronics developed to improve SAC387, look here: http://www.soldertec.com/SITE/UPLOAD/Document/Conferences/Brown.pdf
Electronics Forum | Fri Jun 03 10:04:51 EDT 2016 | sara_pcb
I am planning to attach 1760 pin BGA. The pitch is 1mm and Balls are SAC alloy type. The PCB is for aerospace use and expected to work in harsh environment. What is the recommended PCB surface finish and the attachment process for such a applicatio
Electronics Forum | Fri Jun 03 16:00:44 EDT 2016 | davef
"aerospace" + "harsh environment" = NASA NASA BGA Guidelines - chrome-extension://gbkeegbaiigmenfmjfclcdgdpimamgkj/views/app.html
Electronics Forum | Thu Feb 12 14:26:22 EST 2004 | Kris
Hi all, We have a PCB without any BGAs on it which goes into harsh environment.We therefore conformal coat it. After assembly the PCBs are expected to withstand "85degc/85%RH for 1000 hours" We now want to add a BGA to the PCB. Does any one have
Electronics Forum | Wed Dec 08 06:50:07 EST 2004 | Scott B
Have been trying to cut through Paste supplier 'Qualification' documents and sales blurb but when asked if they'd put their mortgages on the line, assurances are harder to come by. In God we trust - All others must provide data. Are there any previo
Electronics Forum | Fri Sep 17 13:24:27 EDT 2004 | Bob R.
I also agree with Russ - we use step stencils when we have to but generally try to avoid them because the print isn't as consistent as with a single thickness stencil. Many of our products are for harsh environments so we do a lot of thermal cycle a
Electronics Forum | Wed Feb 01 17:36:37 EST 2006 | Cal Kolokoy
Your method of only using solder paste to form the solder joint w/out collapsing the ball is very unconventional, just as others have mentioned on this thread. I bet you those joints will fail under thermal and mechanical stress. Have you done due
Electronics Forum | Thu Sep 27 17:25:33 EDT 2007 | chef
The short answer is immediately after reflow the problem occurs. To be more exact, what you are describing is not "rust". Rust occurs in iron. The oxidation that occurs in Tin-Lead has been sometimes called "white rust". Either way, oxidation occur
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