Electronics Forum: hasl

Entek OM

Electronics Forum | Fri Mar 04 08:29:53 EST 2016 | esoderberg

Anyone using Entek OM final finish to replace HASL & ENIG?

Poor reflow over gold plating

Electronics Forum | Wed Jun 29 17:18:41 EDT 2005 | GS*

Very interesting tread, many thanks to all. Matt please, now what does it mean for you? Will your custmer accept dull solder joints or will the plating be changed ? (ie. HASL, ENIG, etc) Tnks and regards GS*

not good soldering

Electronics Forum | Mon Sep 17 12:21:43 EDT 2018 | bpeay

M_, the parts may be similar but the boards look to be different. Is the thermal relief for each lead on each board the same? what is the board finish, HASL, Enig, OSP or other? The part itself may not be your problem but the part that is partial pla

Gold versus HASL

Electronics Forum | Fri Sep 13 14:35:03 EDT 2002 | davef

Thanks Bernard. On your profile: Adding gold to your solder alloy will increase the liquious temperature. So slowing your reflow oven conveyor is a perfectly reasonable approach, especially for pads with low surface area. We don't even notice a di

BGA vrs CGA....

Electronics Forum | Sat Sep 20 11:44:39 EDT 2003 | Gabriele

Few questions: - wich type of C-CGA ? (CAST or CLASP column to ceramic attach) - column pitch ? - column count ? - capped (with lid) ? or capless (c4 die on top)? - PCB board zize and thickness ? - PCB copper finisch ? (OSP,HASL, ENIG, etc) - v

BGA relow without solder paste?

Electronics Forum | Wed Sep 21 16:25:43 EDT 2005 | GS

IPC-7525 tells you how to make stencil apertures for BGA IPC-7095 tells you how much should be the paste volume in order to get a reliable BGA solder joint. How are your PCB finisced? (HASL, ENIG, OSP, etc?) In case of not HASL, it could be necessa

Pinhole Solder Joint Reliability

Electronics Forum | Mon Jul 21 08:34:44 EDT 2003 | Don Bell

Blow holes/ pin holes in solder joints are the result of multiple root causes. Suggested analysis might look like this; 1) What method of solder preservation is used on the bare board. (hasl,enig, osp, etc.) HASL can leave unwanted flux residues,

Solder balls after wavesolder

Electronics Forum | Wed Nov 14 20:28:24 EST 2001 | davef

Not to worry. Just run the boards through the cleaner. It will remove all the solder balls. The gross filter on your washer will collect all the solder balls. Coo eh? ;-) How to cure SM? Is your mask UV, er thermal? After learning the type, you

Latent shorts on QFN package

Electronics Forum | Fri Mar 06 10:32:34 EST 2009 | fountain42

Yes, We've already experienced this same problem. 1) What kind of flux are you using? No Clean? Rosin? OA? 2) If it's OA, What kind of water wash do you do? Do you use DI water? How Hot? Who's machine? What are the pressures? 3) Have you performed a

pcb manufacturing

Electronics Forum | Wed Jan 13 04:27:00 EST 2016 | crystalpcb

Hi Here is our factory production capability: Shenze Electronic PCB Specification Layer Count 1 to 35 Layers Material Brand Shengyi,KB,GRACE,ISOLA,Rogers,Taconic,ARLLON,Bergquist Base Material FR-4(TG135,TG150,TG170,TG180),Halogen Free FR-4,Ceramic

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