Electronics Forum: hasl enig (Page 1 of 11)

enig

Electronics Forum | Mon Jan 03 16:34:10 EST 2005 | davef

The main advantage if ENIG over HASL is that ENIG is flat and HASL generally is not. The main disadvanages to ENIG over HASL are: * Cost of ENIG is 1.5 - 2X higher than HASL * Selflife is less than HASL * You solder to nickel, rather than copper * E

enig

Electronics Forum | Tue Jan 04 12:37:41 EST 2005 | Cmiller

We have been using this finish almost exclusively for fine pitch boards for about 5 years. Make SURE you use a board house that does the gold plating in-house. There are some potential issues as DaveF stated. The only problem we have encountered is w

Entek OM

Electronics Forum | Fri Mar 04 08:29:53 EST 2016 | esoderberg

Anyone using Entek OM final finish to replace HASL & ENIG?

Gold versus HASL

Electronics Forum | Fri Sep 13 14:35:03 EDT 2002 | davef

Thanks Bernard. On your profile: Adding gold to your solder alloy will increase the liquious temperature. So slowing your reflow oven conveyor is a perfectly reasonable approach, especially for pads with low surface area. We don't even notice a di

Poor reflow over gold plating

Electronics Forum | Wed Jun 29 17:18:41 EDT 2005 | GS*

Very interesting tread, many thanks to all. Matt please, now what does it mean for you? Will your custmer accept dull solder joints or will the plating be changed ? (ie. HASL, ENIG, etc) Tnks and regards GS*

not good soldering

Electronics Forum | Mon Sep 17 12:21:43 EDT 2018 | bpeay

M_, the parts may be similar but the boards look to be different. Is the thermal relief for each lead on each board the same? what is the board finish, HASL, Enig, OSP or other? The part itself may not be your problem but the part that is partial pla

BGA vrs CGA....

Electronics Forum | Sat Sep 20 11:44:39 EDT 2003 | Gabriele

Few questions: - wich type of C-CGA ? (CAST or CLASP column to ceramic attach) - column pitch ? - column count ? - capped (with lid) ? or capless (c4 die on top)? - PCB board zize and thickness ? - PCB copper finisch ? (OSP,HASL, ENIG, etc) - v

BGA relow without solder paste?

Electronics Forum | Wed Sep 21 16:25:43 EDT 2005 | GS

IPC-7525 tells you how to make stencil apertures for BGA IPC-7095 tells you how much should be the paste volume in order to get a reliable BGA solder joint. How are your PCB finisced? (HASL, ENIG, OSP, etc?) In case of not HASL, it could be necessa

Re: HASL vs. ENIG

Electronics Forum | Thu Dec 14 19:38:28 EST 2000 | Dave F

OK, now let me ask the really dopey question ... so if the irregularity of the HASL surface is punching holes in the thermal gasket and causing shorts to the heat sink, why are you putting solder on that surface? I wonder how the thermal conductivit

paste Sn42/Bi58 and Lead Finish

Electronics Forum | Sat Nov 03 11:08:24 EDT 2012 | anvil1021

We have experience with this alloy, but with enig and we did start with PB HASL, none of our PCBs would of course pass thermal cycling at normal temperatures with the HASL so we went to ENIG. we could thermal cycle at 100-115C with no issues. We foun

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