Electronics Forum: hasl solder thickness (Page 1 of 203)

solderability and hasl thickness

Electronics Forum | Wed Sep 10 09:32:56 EDT 2003 | swagner

Dave F, so what kind of problems would I see if this turned into a problem?

solderability and hasl thickness

Electronics Forum | Thu Sep 11 09:22:27 EDT 2003 | swagner

Is there any conceivable way this could cause a tombstoned device?

solderability and hasl thickness

Electronics Forum | Fri Sep 12 13:14:33 EDT 2003 | Mark Kostinovsky

A little adition to Norm's statement: Sn-Pb intermettalic compounds do not accept solder as they are (even without being oxidized).

solderability and hasl thickness

Electronics Forum | Tue Sep 09 15:10:01 EDT 2003 | swagner

Has anyone had negative experiences with hasl thicknesses below .00005'' of an inch on copper? If so could you please respond with what the problems were. Thanks in advance!!!

solderability and hasl thickness

Electronics Forum | Fri Sep 12 09:10:23 EDT 2003 | Norm Morikawa

Around 1989 I had this probelmm with a SMT CCA that would not solder in one area consistently. I had it cross sectioned by the bare board supplier and found that under their metallurgical microscope the thickness of this HASL bare board could not be

solderability and hasl thickness

Electronics Forum | Tue Sep 09 18:07:18 EDT 2003 | davef

We would be very wary of allowing 50 uinches, because this will likely result in reduced shelf life due to intermetallic growth. As a guesstimate, at least 10 uinches of that 50 uinches, and maybe more, is already intermetallic when you receive the b

solderability and hasl thickness

Electronics Forum | Wed Sep 10 12:56:09 EDT 2003 | davef

Intermetallic compounds [IMC]: * Form during the alloying process of some metals. In soldering these are Sn, Ni, Ag, Cu, Au. * Do not accept solder. * Increase in depth in logarithmic proportion to both time and temperature. [So during the solder

solderability and hasl thickness

Electronics Forum | Thu Sep 11 16:50:18 EDT 2003 | davef

Sure it's conceivable that thin HASL can cause tombstoning. Harkening back to the ample discussion in the fine SMTnet Archives, tombstoning is caused by an imbalance in solder surface tension between the two pads of SMT component. The source of thi

Stencil thickness

Electronics Forum | Thu Mar 02 13:04:22 EST 2006 | Chunks

0603 parts at .2mm spacing is pretty easy. But are there any other parts, like fine pitch QFPs? Is your board HASL or something else? Is there resist/mask between all pads? If it's just 0603's at .2mm, then you can probably go 7 mils and get good

Tin-Lead thickness on PWB's

Electronics Forum | Mon May 18 13:18:25 EDT 1998 | Chrys

I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered and soldera

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