Electronics Forum | Mon Oct 06 11:13:32 EDT 2003 | marmotzj
Dear All, I'm encountering a problem on mounting Intel E7501 and P64H2 FC-BGA chips. After the SMT process, these two BGAs were defected. Both had power-to-ground short circuits on the die package itself, and also the die resin had cracking tracks
Electronics Forum | Tue Jan 21 11:03:15 EST 2003 | MA/NY DDave
Hi You already received good answers. A thing to remember is the components and the PCB. How high you go above 63/37's 183C should be limited to create a good solder joint. Too long creates problems since the components and the PCB start to be he
Electronics Forum | Wed Mar 30 15:29:37 EST 2005 | Mark
I am not an expert however, I don't see any issues with this. Those joints of nearby components will melt and solidify back once they go below 183 C. Don't see how this could present quality issues as components may pass through reflow several time
Electronics Forum | Wed Jul 19 16:20:34 EDT 2006 | dave
kris, Thats what I said when the rep. advised me. But I had called him in to advise me on some problems I was seeing on a certain boards. When we ran at this elevated Temperature "bingo" the results were perfect. So as you know yourself wrt wave pro
Electronics Forum | Mon Apr 14 09:39:49 EDT 2003 | davef
Consider: * Sn has a higher melting point than Pb. So the liquidous temperature of this new, non-Sn63 is going to be higher than 183*C. What was the thermal recipe measured on this solder connection? * Next thing we'd do is take problem devices and
Electronics Forum | Thu Jul 29 00:42:32 EDT 2004 | C.W
hello, BGA was a little excessively reflowed with dwell time(above 183C - solder paste = 63/37) over 2 min, peak temp is 218C. I inspected the BGA under X-ray and there is a little voids but within the acceptable range, i then used the Ersascope to c
Electronics Forum | Tue Oct 31 14:52:25 EST 2000 | Dr. Kantesh Doss
Hi Antonio: You clearly have printed excessive amount of solder paste on the pad. You can reduce the amount of paste by one or two methods: 1. Switchover to 5 mil thick stencils. 2. Change the design of your stencil openings (at the discrete compone
Electronics Forum | Mon Jan 12 21:39:09 EST 2004 | Bryan
15 C. it's very hard to decrease the Delta T. and the socket temperature always the lowest one because of it's large ,partly metal composed body.is there anyone can share with me the profiling experince of P5 socket? or any suggestions will be greatl
Electronics Forum | Tue Mar 09 07:51:12 EST 2004 | Bryan
Hello everyone: 1.I use Kester R244 63/37 solder paste. 2.Stencil thickness 6 mil. 3.Springdale Chipset. 4.PCB finish:HASL 5.Profile:Peak temp.:210~220C,time above 183C:60~90 seconds,time between 150~183C 60~90 seconds. 6.Reflow oven:Heller 1800 Voi
Electronics Forum | Fri Aug 17 08:37:47 EDT 2001 | jbieber
Gregory, I think that the profile is too radical, i.e. zone 6 to zone 7 temperatures are too far apart. I would guess that the solderjoints have not all reached 183C in zone 6 which is why the uBGA's do not have a symmetrical ball collapse. You may
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