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Design of experiments 2E2 help!

Electronics Forum | Thu Aug 20 13:59:42 EDT 2009 | dcell_1t

Hi there! After various trial-error experiments we determined that two factors are the most insignificant in order to reduce or make worst the issue, those factors are: Placement force: regular placement vs "force applied" to dip the component on th

Component price database - which or how?

Electronics Forum | Thu Aug 27 23:51:10 EDT 2009 | leadthree

I have a little problem. We are assembly subcontractor and we purchase most parts ourselves. Currently we have all BOM/Partlists in an Excel format. We get a few RFQ each month, prices come from well known original sources, Mouser, Digikey etc. and

gpu removal

Electronics Forum | Wed Sep 16 18:25:47 EDT 2009 | larob57

(http://forums.xbox-scene.com/index.php?showtopic=691556) I can make some more pic's for you to see and I will post them in photobucket.Go to my page at this link and then click on my album (http://s1007.photobucket.com/albums/af192/repairman52/)

Researching placement machines - where do I start?!

Electronics Forum | Fri Jan 01 10:17:49 EST 2010 | jeffreyj

Long time no update. We ended up buying a used Quad IIc for something like $2500 + shipping - no kidding - through CAE. They originally wanted $5,200 but they wouldn't commit to saying it was operational and we wouldn't commit to buying it if they di

ESD HANDLING FOR PCBA

Electronics Forum | Mon Nov 02 08:24:44 EST 2009 | rgduval

Umar, We don't think you've violated ESD handling in the manner you've described. If your employees were wearing foot straps, and your floors are conductive/grounded. I've run into this at multiple companies, where transporting the PCBs station

BGA Voiding for RoHS

Electronics Forum | Fri Nov 13 08:27:43 EST 2009 | herman

Your customer is very unreasonable to demand void-free BGA SJs. Minor voiding is not a condition for rejection per IPC-A-610D, J-STD-001D, or even J-STD-001DS (Space addendum). Having said that, let me tell you that the voiding has little or nothing

Bubbles on solder joint(after conformal coating curing)

Electronics Forum | Thu Nov 19 05:18:37 EST 2009 | prodivegsr

Hi All, Recently we are working on the conformal coating process using Humiseal chemical 1B73 and thinner 521. Bubbles on component body/joints are seen after gone through the IR Reflow Oven. During the conformal coating, only tiny bubbles seen af

Basic BGA setup

Electronics Forum | Fri Nov 20 17:50:51 EST 2009 | bigalnz

Hi All, I do PC/Laptop repair and are finding some jobs I cant do because they need a BGA rework. I dont admit to being a pro with respect to BGA, and thus a purchase decision is hard.I have been looking at : http://zhuomao.en.alibaba.com/product/

Assembleon / Philips support. Ask your question.

Electronics Forum | Sat Feb 27 20:02:06 EST 2010 | jmelson

Yup, that seems to be the procedure in the manual. But, it gets complicated, as the head has a rotation, the part has a rotation, and the MA station has a rotation, and it gets pretty confusing to figure out which way to tweak the offset values for

BGA: reworking BGAs, testing and inspection

Electronics Forum | Fri Feb 12 11:45:14 EST 2010 | ppcbs

Greetings, > > We are looking to purchase > equipment to rework / repair our circuit boards > with BGAs. Our newer boards are starting to have > more and more BGAs. > > Is there any information > that "ranks" BGA rework stations? - a kind of a


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