Electronics Forum | Wed Mar 30 19:54:36 EST 2005 | mattkehoe
We've already done it for a customer. We used 63/37 ssd's on the top side where the are a few caps and one 256 pin QFP, coated with adhesive flux to hold the component, and lead free un flattened ssd's on the bottom to be attached to the other boar
Electronics Forum | Tue Mar 22 06:03:55 EST 2005 | Base
Try the IPC-254x CAMX standards (webstds.ipc.org, no www prefix!). They define a set of generic and process-specific XML messages for equipment to send out all sorts of process-related events. I know there are standardized messages for print, dispens
Electronics Forum | Thu Mar 24 19:17:43 EST 2005 | EA
Hi, We are running the automotive product and question was throw to us how do we ensure that our solder joint are good enough after reflow.....and during the sealant process, there's a bit of bend on the nozzle and it toughes the component and custo
Electronics Forum | Wed Mar 30 16:07:24 EST 2005 | Dreamsniper
If there's no shear strength standard for solder joint, how will I define my pad width and length then. I have a 8.5 mils width and my component lead width is 8.66 mils based on manufacturer's minimum width specification. How will I identify that it
Electronics Forum | Fri Apr 01 04:51:53 EST 2005 | dougs
I think what Russ is getting at is that the granite table is used for it's flat surface to aid in measurement, the flat surface helps to measure heights very accuratly. If you add another surface on top of that then you lose what the granite surface
Electronics Forum | Tue Mar 29 14:03:25 EST 2005 | Ed Popielarski
Hi, Steve Gregory brought your post to my attention although I'm not a regular participant in SMTNET. I am an independent service provider and still work on the Treiber systems as well as many other process equipment types and brands. I probably hav
Electronics Forum | Wed Apr 13 15:32:37 EDT 2005 | mmjm_1099
Don't know if this helps at all but here you go. I take care of documentation, smt programming, and bill of materials and notes. We have a smaller company so this is how we handle alot of the issues at hand. Our product traveler consists of what w
Electronics Forum | Sun Apr 03 03:48:05 EDT 2005 | iwan
I have a problem in my Lead Free smt production line,i run BGA product for the first time. The product consist BGA and Connectors. If i increase temperature in Reflow Oven it will be melting the Connector, but when i decrease the temp. BGA become raw
Electronics Forum | Mon Apr 04 18:19:58 EDT 2005 | halal
Hi! I'm new to here, so let me introduce myself. My name is Szathmari Gabor, and I'm an electrical engineer student in Hungary. There is a task in the university that I have to do, so I ask your help, dear smtnet forumers :) The task is: a factory e
Electronics Forum | Wed Apr 06 22:59:02 EDT 2005 | smt_rookie
It is the solder ball that's usually encountered in a reflow process. It's just that, the paste did not wet well along the connector pins. Before reflow, the paste is actually at the tip of the connector, and stayed there and never went up to fill th
