Electronics Forum | Fri Feb 12 12:19:28 EST 2010 | rodrigo
What do you mean by "check if F4G is connecting to CC...". The CC DOS windows shows up when I login the PC so does the remote shell daemon. The CC DOS windows says a bunch of stuff does has been woken. I didn't install the FTP stuff. I didn't think I
Electronics Forum | Sun Feb 14 15:43:32 EST 2010 | jlawson
ERP/ MRP systems can do basic traceability but often fall through as make a lot of asumptions and can not capture realtime info and account for all possible situations. I have seen alot of companies do this and there is always a 'shoe horned' system.
Electronics Forum | Fri Apr 02 12:41:12 EDT 2010 | CL
Nicolas, 4.1.2.1 and 4.1.2.2 mention the requirements for drying an MSD to resett the clock life. 4.1.2.2 states that once a component is dried, refer to 5.3 for safe storage. Under that specification is 5.3.3.2 DRY Cabinet at 5% RH- This states tha
Electronics Forum | Wed Feb 17 12:16:17 EST 2010 | dcell_1t
Hi there: During the past weeks (let's say since beginning of the year) we've been experiencing some issues with shifted components. We verify for position before Reflow oven and the components are Ok, but they observe shifted after reflow. it occurs
Electronics Forum | Thu Mar 11 11:08:22 EST 2010 | geocep
I am using AIM Electropure SN63/Pb37 Solder, & AIM NC266-3 Flux; just like what ACE recommends. I have both Ultra High Pure T-Tanks and a Cryogenic Dewar Tank for Nitrogen, and neither seems to have improved the problem. I place a piece of tempered
Electronics Forum | Thu May 20 18:14:53 EDT 2010 | geocep
Process Flux is AIM 275. Tip tinning flux is Superior 75. We have gotten dual nozzles in the 6mm & 9mm sizes we run. We can get a nozzle to run about 8 hours. Every night we clean all used nozzles with a scouring pad, apply Superior 75 flux with
Electronics Forum | Wed Mar 10 08:31:22 EST 2010 | sibbe
Currently I'm working on a study of the quality of our SMD process. For this I am investigating the possibility of adding an of-line AOI There has been previous research done (late 2007), bij the company I work for. Since there could have changed
Electronics Forum | Fri Mar 26 11:31:34 EDT 2010 | rway
I have been using ICT for a number of years. It is still a viable resource for catching defects in the production process. AOI doesn't catch everything, such as bridging on QFN or J-lead devices (this will depend on the type of AOI and camera syste
Electronics Forum | Fri Nov 18 12:35:15 EST 2011 | rway
As the article eludes to, you still need probe access to measure the pins with TestJet. One thing I wanted to add was the use of JTAG for use with Boundary Scan. Certain devices have JTAG capability, but not all JTAG devices are Boundary Scan compa
Electronics Forum | Fri Mar 26 10:35:52 EDT 2010 | grahamcooper22
Hi Krish, thanks for your detailed reply. Sorry I assumed you may be using a solder paste to solder the BGA to the pcb. Either solder paste or Gel flux is best for resoldering BGA to pcb. Are you using Gel flux ? Most popular long term storage for mo
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