Electronics Forum | Wed Nov 02 04:28:58 EST 2005 | Simon
Hi James, I have worked in many SMT sites and this is not an uncommon practice. It is true that print deposit consistency will improve after the first few prints as the aperture walls become lubricated, but with modern stencils/paste and a well-desig
Electronics Forum | Thu Nov 03 11:23:40 EST 2005 | JeffP
Jay, What are your board sizes? What is the maximum size that you envision reflowing? 10-50 boards a week . . . is that in a single run or broken down into a few boards a day/hour? Do you have a high mix or is it a single product? Are the boards
Electronics Forum | Thu Nov 03 12:29:41 EST 2005 | jdengler
Jay, As a CM you can forget about planning the types of boards you will be running. A CM needs to be flexible these days to stay in business. Forget the batch oven they are not flexible and have many limitations as pointed out earlier. Look for a
Electronics Forum | Thu Nov 03 12:52:23 EST 2005 | Amol
the only problem i see here is the neighboring components (depending upon the component density) will surely undergo a second reflow during the rework stage for the BGA. this way the only lead you will have in the BGA assembly is if you are using HA
Electronics Forum | Sun Nov 06 06:16:14 EST 2005 | grantp
Hi, We have been running Soltec reflow and wave, and are very happy with them. The software on the Soltec oven is great, but a bit stupid on the wave. However they are both great units, and after about 38,000 PCB's they are still totally clean with
Electronics Forum | Fri Nov 04 08:10:04 EST 2005 | Amol
Hi all, If i know my field conditions and the required lifespan of the final product, how can i decide what thermal cycle to use for ATC to qualify the product?? I have the JEDEC standards for min-max temps and dwells, but how do i translate them int
Electronics Forum | Fri Nov 11 09:41:12 EST 2005 | Eric C
Thanks for all your inputs. As I read through your responses, and through my research on the web, I have learned there are so many options to try and evaluate. The material we are using is loctite FP4531 - a snap cure flip chip underfill. Loctite ha
Electronics Forum | Tue Nov 15 06:46:41 EST 2005 | cyber_wolf
We have an earlier version of TPSYS. 2.4.1c We see this happen occasionally as well. It only seems to happen on our MY-12 machine. Our TP-11's never do it to my knowledge. I highly doubt that it is isolated to your company. If your machines are new,
Electronics Forum | Tue Nov 08 15:44:35 EST 2005 | Red
I just received a reel of RoHS parts but I have a rejection rate of 15% since I started using it.Does anyone has experience this so far? My machine Mydata My12 with TPsys 2.2.5e
Electronics Forum | Wed Nov 09 13:46:07 EST 2005 | russ
Anybody out there have any experience with the above? We are looking into buying one of these things. We need to process large thin boards to small thick boards both pb and pbfree solders. Components will range from uBGA and CSP to ????? It is a
