Electronics Forum: having (Page 2469 of 3477)

PCB Solder Finish Survey

Electronics Forum | Sat Jul 24 10:20:15 EDT 1999 | Bob Willis

PCB Solder Finishes Survey Questions 1999 Results for the 1996-7 survey are located at www.smartgroup.org As a number of SMART people have requested an update on the solder finishes survey SMART Group have run in the past here is your opportunity t

Re: Ghost circuit shorts under smt resisters only when they are located on solder side of pcb (glued down)

Electronics Forum | Fri Jul 30 09:43:44 EDT 1999 | C.K.

| We are having a process related problem with pullup resistors on a controller card which has a I960 micro-processor. | The controller monitors signal inputs and it's own resources then blinks a LED to indicate its working. The problem is that after

Re: Profiling

Electronics Forum | Thu Jul 29 11:58:06 EDT 1999 | Greg Jones

| | | | Which among the two profiling method is more reliable/accurate in getting the oven thermal profile? | | | | | | | | a) using a HIGH-TEMP solder wire then soldering the thermocouples onto the profile points of the board (e.g. component lead e

Re: Solder Paste from 500 gram tubes.

Electronics Forum | Tue Jul 20 10:08:30 EDT 1999 | Wolfgang Busko

| | I recently switched from solder paste in 500 gram jars to 500 gram tubes. I did this to try to limit the time the paste is exposed to the room environment. But we have a need to clean the stencil every 4 - 5 boards which means taking the bulk pas

Re: Andon BGA Socket Soldering Problem - Ball Collapse

Electronics Forum | Thu Jul 15 08:03:36 EDT 1999 | Mark Quealy

| | I am trying to solder a 388 ball BGA to an Andon Electronics Corp. BGA socket adapter and I am having problems in the reflow of this part. I put no clean paste flux in the solder cups of the adapter then put the BGA part onto the adapter and run

Re: problem in micro-BGA assembly

Electronics Forum | Thu Jun 24 23:52:36 EDT 1999 | Dean

| | | Dear guys, | | | | | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We

Re: bare board problem

Electronics Forum | Thu Jun 17 20:48:18 EDT 1999 | Earl Moon

| | first of all what is the technical term for the small amount of solder on a plated pad. we are getting poor screen printing gasketing on a 20 mil qfp due to this solder not being even or too high in spots and not covering the length of the pads.

Re: Hot Bar Mfg.

Electronics Forum | Wed Jun 16 14:06:01 EDT 1999 | Jagman

| | | | A potential customer of our is inquiring if we have capability | | | | for Hot Bar manufacturing in the PCBA manufacturing world. If someone can explain to me what this entails, I would greatly appreciate it. Thank you. | | | | | | | One

Re: Your Server is Slower than Molasses

Electronics Forum | Wed Jun 16 06:16:44 EDT 1999 | Brian

I'm sorry, Cliff, but what you say is akin to bovine excrement. The problem is that your server is shared and is in Fort Lauderdale, which is at the end of a spur from one of the Atlanta nodes of the Internet backbone. The available bandwidth on this

the facts on our server

Electronics Forum | Wed Jun 16 10:44:04 EDT 1999 | Clifford Peaslee

Brian, Thanks for your concern, and maybe there is fear that we are trying to mislead people, which is not true. We do not have the server in house here in Portland, Maine. It is in Fort Lauderdale, Florida, at Advances.com. We are sharing a netw


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