Electronics Forum | Thu Oct 08 14:04:04 EDT 1998 | Kris Ewen
Manish, I've seen similar phenomenon when processing CSPs on our cards. In our case, we were placing the components over the opening to in-pad blind vias. Due to poor drilling and plating processes by our board suppliers, volatiles were outgassing
Electronics Forum | Wed Oct 07 15:25:02 EDT 1998 | Joe P.
Hi Everybody | | Is anyone aware of the possible causes that may lead to voids in the solder bumps after assembly. We assembled some dice on thin substrates and after assembly, void formation in the solder bumps were observed. | We have alread
Electronics Forum | Wed May 03 20:04:21 EDT 2000 | Dave F
Joe: Hey, just hose everyone down with water when your humidity starts to decrease to below 40%. ;-) Actually, that�s how some humidity controllers work, when added to your heating system. Well basically that�s how they work. I�m not tryin� to
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