Electronics Forum | Wed Mar 03 13:33:25 EST 2004 | stefwitt
How well should the fiducial be centered in the teach mode? Consider that you see the fiducial with probably 40 times magnification on the monitor. If you see the cross-hair a bit off center, then this is most likely just by a few hundreds of a milli
Electronics Forum | Thu Aug 02 22:33:24 EDT 2007 | simsj
We've had some experience with Universal's machines as well. Aside from the mechanical problems you're experiencing, that level of control hardware is susceptible to power spikes/fluctuations. Save yourself some trouble later on and get a good UPS.
Electronics Forum | Mon Oct 06 15:17:12 EDT 2008 | davef
Q1: You say that 0.008" of "slop" is un-doable; hence, the reasons for our failures. Any basis for that statement? A1: We're not even considering the accuracy of your placement machine. We base our comments on the gap between the hole and the connec
Electronics Forum | Mon Nov 09 09:18:09 EST 2009 | meritajs
I absolute agree with Adlsmt that your subcontractor was slipshod worker. It’s impossible for normal subcontractor make such fault. For last 15 years I worked for subcontractor firm here in Riga Latvia. Our company was not very advanced. As I said be
Electronics Forum | Fri Jul 30 09:43:44 EDT 1999 | C.K.
| We are having a process related problem with pullup resistors on a controller card which has a I960 micro-processor. | The controller monitors signal inputs and it's own resources then blinks a LED to indicate its working. The problem is that after
Electronics Forum | Tue Jul 27 17:47:36 EDT 1999 | Earl Moon
| While inspecting incoming PCBs we detected around all plated-through-holes (only there and all in the same place) some halfmoonshaped light rings that match obviously only with the pink ring symptom shown in the IPC-A-600 chapter 2.5.2.. That would
Electronics Forum | Mon Oct 12 08:07:45 EDT 1998 | Earl Moon
| I have datas to substain that a not wetting PCB ( the HAL oxided or not uniform in thickness )if soldered in reflow, it shows voids with X-Ray inspection.The voids are in side all the joints not only on the solder pads levell. | | Is there a techn
Electronics Forum | Fri Apr 29 14:16:16 EDT 2011 | ppcbs
Below is the long explanation. This defect is most commonly found with BGA components, but can arrise with all components. I see it happening more now with lead free boards that are being assembled with a no clean flux. Best short term remedy is t
Electronics Forum | Mon Sep 20 13:04:25 EDT 2004 | davef
The Intel BGA Developer�s Guide [ http://developer.intel.com/design/packtech/ch_14.pdf ] says: 14.8.3.3 Plated Through Hole (PTH) Isolation Regardless of the technique used for the mounting pads shape or definition, isolation of the plated through h
Electronics Forum | Mon Dec 20 11:58:34 EST 1999 | Chris May
Mike, I can only reiterate what Wolfgang has covered. How have you manufactured these previously ? Were they small hand built batches and now you are ramping up production ? Does the $150K include materials or is it free issue ? If a manufacturer
