Electronics Forum | Fri Nov 20 10:44:46 EST 2015 | cgreiner
Hello > > I got a SiPlace 80-S20 machine which had > a damaged hard drive in MC. I changed HDD and > re-installed RMOS + MC from floppies. Then I > turned on the machine (without any Line > Computer). > > The software on Station computer > wou
Electronics Forum | Mon Jun 11 22:06:00 EDT 2001 | davef
The issue is not the cleanliness of your in-bound water. The issue is the cleanliness of the board your customer receives. Look at J-STD-001C, Para 8, "Cleanliness Requirements". The end product cleanliness is the end result of your: * In-bound
Electronics Forum | Tue Jan 12 10:18:36 EST 1999 | Russ Steiner
| Any idea what the "industry standard" is for fall out on assembled PCB's? I realize that the controls put in place in your processes will effect your overall quality. But I'm trying for a general answer. On pre-tested assemblies, should you exp
Electronics Forum | Mon May 07 16:07:05 EDT 2012 | davef
Start with targets based on the stencil thickness (for height) and stencil thickness times the aperture size (for volume). * Set reasonable upper and lower control limits (+ 25% and –25 % of the targets, for example). * Next, check the printer set-u
Electronics Forum | Wed Jul 01 13:17:39 EDT 2015 | davef
Cheryl Tulkoff and Randy Schueller do a good job summarizing the thinks on pad cratering here: http://www.smta.org/chapters/files/uppermidwest_padcratering.pdf Potential Mitigations to Pad Cratering * Board Redesign * Solder mask defined vs. non-s
Electronics Forum | Tue Mar 02 02:46:36 EST 2021 | Jessie Gao
If there is a way to ensure that the product is reliable, it is to ensure the predictability of its PCB, which is an important part of the product. In fact, PCB is the core component in almost all electronic products (from phones to computer systems)
Electronics Forum | Mon Oct 03 10:41:57 EDT 2011 | patrickbruneel
Some of us here attended the 5th CALCE international symposium on tin whiskers http://www.calce.umd.edu/symposiums/ISTW2011.htm where one of my former professors, Dr. Henning Leidecker, talked about the tin whiskers he and the others at NASA Godda
Electronics Forum | Mon Feb 21 11:22:21 EST 2000 | K. Ckak
Hi Kurt, I agree with Dave F. I had exact same problem with PBGA placement. We requested our PCB vendor to plug/tent via (button printing) after HASL with SR1000 which worked well in the long run. There are couple of failure modes associated wit
Electronics Forum | Mon Feb 21 11:22:21 EST 2000 | K. Ckak
Hi Kurt, I agree with Dave F. I had exact same problem with PBGA placement. We requested our PCB vendor to plug/tent via (button printing) after HASL with SR1000 which worked well in the long run. There are couple of failure modes associated wit
Electronics Forum | Wed Sep 12 12:55:34 EDT 2001 | stevearneson
The CyberOptics LSM 300 cannot provide true 3D volumetric measurements. It is impossible to measure volume using a "Box" that is drawn around a feature without the same characteristics. Owners of the LSM 300 try it for yourself. Move the stripe ar
