Electronics Forum | Mon Jan 08 20:57:52 EST 2001 | Dave F
Are you talking about bare board cleanliness or assembly level cleanliness? Bare board cleanliness is still primarily measured by resistivity of solvent extract (ROSE) using instruments such as Omegameters and Zero Ions. What is considered as "acce
Electronics Forum | Tue Sep 25 09:56:09 EDT 2001 | nwyatt
Hi, thanks for your input. Yes, we do have a rework station - specifically a SRT Summitt 1000 station, but it causes us many problems and is down more than it's up...I do not think that using it would speed up the process at all. As far as accuracy
Electronics Forum | Sun Nov 14 20:52:38 EST 1999 | chartrain
What is your definition of a lot of money for a UPS? You mention very expensive components on your boards. What is their worth comapred to the UPS? A generator hooked to the conveyor would in theory work. but what is the cost of the generator? Who wi
Electronics Forum | Sat Jul 24 00:31:21 EDT 1999 | Scott McKee
| Has anyone ever heard of testing solder paste quality by pasting a board and making a determination of the quality by measuring paste height and width after the board is pasted. Would you consider this a valid test for solder paste testing? | I ag
Electronics Forum | Fri Feb 01 10:19:22 EST 2002 | cyber_wolf
Whoa! I beg to differ my friend. The cure profile is VERY critical in Adhesive curing, especially if your are screen printing. When you screen print adhesive you are leaving it exposed to the atmosphere for a period of time. SMT adhesive by nature i
Electronics Forum | Fri Apr 16 08:20:58 EDT 2004 | Bob L.
We've seen problems with BGA balls breaking at in-circuit test. I did some bend testing and found that our large BGA's can handle amazing stresses at low strain rates but we get brittle fractures at high strain rates, especially with Ni/Au surface f
Electronics Forum | Tue May 17 08:00:26 EDT 2005 | Bob R.
We went through this with one PBGA supplier recently and they were able to get the problem under control by fixing some of their molding processes that were inducing residual stresses. You can really see it in a thermal moire where you measure warpa
Electronics Forum | Fri Mar 31 12:27:27 EST 2006 | Marcus
We have used the SN100C for over a year now with fanastic results. We use the SAC305 for SMT and SN100C wire exclusively. There are no problem mixing the alloys. I am also on the commitee for the NASA testing. The SN100C did out perform SAC and SnPb
Electronics Forum | Wed May 10 11:03:04 EDT 2006 | Mike Konrad
I would be far more concerned about the flux residue intentionally left on the board than the �dust bunnies� sticking to the flux. In �perfect� no-clean applications, flux residue, although present, is nearly invisible and marginally conductive. In
Electronics Forum | Wed Mar 14 00:34:46 EDT 2007 | pyramus
Hi Muhammad thanks for the reply. However, this is my current situation. We are currently using some BGA's with this kind of packaging BGA over BGA. I have verified solderability of the main BGA (below Bga the one w/c will be soldered to PCB) using
