Electronics Forum | Mon Oct 05 08:19:13 EDT 2009 | rgduval
We've been having random transducer errors on our TP recently. After speaking with MyData tech support, we were told the answer could be: 1. the transducer(s), 2. something causing undue friction, 3. something undiagonsed yet. Their recomendation
Electronics Forum | Wed Mar 28 09:59:47 EDT 2012 | bradlanger
Sounds like you have tried everything I can think of as far as hardware is concerned. One thing that sounds suspicious to me if the error "Failed to create empty document". I have only seen that error when my MMI software got corrupted in the process
Electronics Forum | Thu Dec 04 10:59:02 EST 2014 | rrosera
HI, I work for a company in New England and recently had a unusually large number of boards fail after replacing a BGA on them. We use a AirVac DRS25 to remove and replace the BGA witch uses local forced hot air. We usually have at least a 90% s
Electronics Forum | Fri Jun 03 10:11:08 EDT 2016 | tnisbet
If you end up buying a depaneling machine/robot, > the guys at Pentagon EMS are very good at making > fixtures. Once they have the specifications of > your machine all you will have to send them is > your panelized drawing of your board. In extre
Electronics Forum | Tue May 28 18:31:08 EDT 2019 | jlawson
Solder paste flux is main contributor, Lead termination chemical-oxide by products and PCB Plating-Chemicals. Reflow profile would have very limited if not no impact really unless is way off. Paste volume control and Stencil design plays a big part
Electronics Forum | Thu May 04 01:52:17 EDT 2023 | davef
Look at IPC-7526 - Stencil and Misprinted Board Cleaning Handbook, Misprinted Circuit Board CleaningCLEANING [ https://www.multi-circuit-boards.eu/fileadmin/user_upload/downloads/leiterplatten_design-hilfe/ipc-7526.pdf ] ITW/EAE says "Typically, th
Electronics Forum | Tue May 26 16:59:47 EDT 1998 | Gary Simbulan
I know, I've read the "been there done that" stories about this subject, but I still profess ignorance on some aspects. We are using NPO type dialectric caps in potted high voltage assemblies and continue to experience catastrophic vailures. Upon
Electronics Forum | Wed May 27 15:00:32 EDT 1998 | Scott Cook
| The question raised by our components engineering group is, is it possible to tell whether these failures are thermally or mechanically induced. The focus of design engineering up until now has been on process. Are our reflow temps ok, are the pa
Electronics Forum | Wed May 16 12:08:24 EDT 2001 | raton
Some thoughts- Torque applied to each joint is case specific. I know there are charts and all, but they don't account for YOUR situation such as screwing a fab to a chassis(or your aluminum screw). If the customer sets a spec then use it. (But i
Electronics Forum | Fri Mar 07 10:51:58 EST 2003 | MA/NY DDave
Hi O'Conner, I hope you also tell us what Universal-GeorgeW discusses with you. It is a little strange seeing his name on this list and his phone number. Gee I can give you his email address but won't.. Again distance engineering is tough. I woul
