Electronics Forum | Thu Sep 02 04:26:02 EDT 1999 | Wolfgang Busko
| | To aid in heat dissipation of our PCB, we would like to try having copper fill areas on the board that are hot air levelled and not covered with solder resist. Then, when the board is reflowed, solder paste would be applied and then solder. Has a
Electronics Forum | Thu Dec 19 20:40:08 EST 2002 | jonfox
One common practice, depending on what is on the other side of the PCB and how much heat you need to draw away from the part, is to manufacture a pseudo-heatsink into the board itself. It looks like a large tinned pad but has a dense array of vias f
Electronics Forum | Thu Dec 19 20:45:47 EST 2002 | jonfox
One common practice, depending on what is on the other side of the PCB and how much heat you need to draw away from the part, is to manufacture a pseudo-heatsink into the board itself. It looks like a large tinned pad but has a dense array of vias f
Electronics Forum | Mon Jun 19 19:08:21 EDT 2000 | Brian W.
IPC-610 Rev B: Paragraph 4.1 (page 52), As an exception to fil requirements on Table 4-1 on thermal heat sink planes plated through holes, a 50% vertical fill of solder is permitted, but with solder extending 360 degrees around the lead with 100% wet
Electronics Forum | Thu Dec 20 12:27:25 EST 2001 | seand
Hello Gentlemen, Dave has a good point. Proposing to move the rails for the sake of thermal integrity doesn't seem logical to address you issue. By adding a rail set you have simply added mass (almost like big heat sinks) throughout the oven vs. w
Electronics Forum | Mon Jun 19 22:47:36 EDT 2006 | davef
So, a 10SWG is about an 8AWG. We can't think of a IPC standard for design of this type of product. That the solder is running up the wire indicates something is wrong. We wonder if either: * Holes in the board might be too large for the wire. Doe
Electronics Forum | Wed Dec 24 11:49:46 EST 2008 | bandjwet
Put on your thinking caps for this one......We are trying to remove a BGA (10 x 10mm, plastic, 0.8mm pitch) which is approx 3 mm next to another BGA (5 x 5mm, plastic, 0.8mm pitch). The challenge is this second device is underfilled with a softening
Electronics Forum | Wed Feb 16 15:29:15 EST 2000 | John S.
My company manufactures electronic modules for the automotive industry. We have a current product that the customer would like a "heavy duty" version of. The module will have to handle roughly twice as much power as the original. A couple of compo
Electronics Forum | Wed Feb 16 15:29:15 EST 2000 | John S.
My company manufactures electronic modules for the automotive industry. We have a current product that the customer would like a "heavy duty" version of. The module will have to handle roughly twice as much power as the original. A couple of compo
Electronics Forum | Sat Aug 04 12:03:25 EDT 2001 | johnw
The reason we're putting the epoxy in at the last process is two fold really. 1. as you suggest putting the componnd down prior to placement is going to cause issues around the placement of the device. But more importantly 2. the material speced by
