Electronics Forum | Thu Sep 02 16:52:31 EDT 1999 | Earl Moon
| | | Has anyone done or seen any studies done documenting what may be the affect of hardware such as screws in the parimeter vicinity of BGAs on a circuit board? | | | | | | What I'm really after is anything describing how close a screw/washer/nut
Electronics Forum | Wed Jun 23 13:56:56 EDT 1999 | Stan Frul
Hi Could anyone tell me where i can find information, in the literature or on the Web, concerning measurements of temperature distribution, expansion, stresses in the substrate and heat sink and on the interface between them, that is all the range of
Electronics Forum | Thu Jun 24 11:29:50 EDT 1999 | Matt Stump
| Hi | Could anyone tell me where i can find information, in the literature or on the Web, concerning measurements of temperature distribution, expansion, stresses in the substrate and heat sink and on the interface between them, that is all the rang
Electronics Forum | Sat Feb 19 05:07:28 EST 2000 | Dean
I'm not exactly sure of your problem...but I'll give it a shot. I assume the screw is on the solder side of the board. If you wave solder the screw the head will fill in with solder. Try a water solouble mask or peelable laytex mask over the screw
Electronics Forum | Sat Feb 19 05:07:28 EST 2000 | Dean
I'm not exactly sure of your problem...but I'll give it a shot. I assume the screw is on the solder side of the board. If you wave solder the screw the head will fill in with solder. Try a water solouble mask or peelable laytex mask over the screw
Electronics Forum | Wed Feb 16 05:00:50 EST 2000 | Dean
What is the package type? TO92, TO5...etc. This temp. sensing device clips (mechanically) to the sink. And this requires a special tool? How about thermo bond heat sink compound? "output" by loc tite is the only flavor I can think of...There a
Electronics Forum | Wed Feb 16 05:00:50 EST 2000 | Dean
What is the package type? TO92, TO5...etc. This temp. sensing device clips (mechanically) to the sink. And this requires a special tool? How about thermo bond heat sink compound? "output" by loc tite is the only flavor I can think of...There a
Electronics Forum | Tue Feb 22 04:29:29 EST 2000 | Gwen Z
First I apologize for my poor English writing. we have no heat sink fins and active cooling with power module. when the board is transported,the vibration of board and power module will shotten the solder joint lifetime. if we just solder it withou
Electronics Forum | Tue Feb 22 04:29:29 EST 2000 | Gwen Z
First I apologize for my poor English writing. we have no heat sink fins and active cooling with power module. when the board is transported,the vibration of board and power module will shotten the solder joint lifetime. if we just solder it withou
Electronics Forum | Fri Feb 05 04:18:44 EST 1999 | Joni Siipola
| Joni: What is it about your situation with the board/component/process that makes you want to explore alternatives? Dave F Dave: In our case the component is placed on metalled footprint which has via holes to transfer the heat via holes to the
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